المؤلفون: Zhou, Wenchao

وصف الملف: text

الإتاحة: https://www.accessscience.com/content/article/a694300

المساهمون: Geng, Hwaiyu., Zhou, Lin., Park, Ilsun., Ravi, K. V., Rathore, Hazara S., Chanda, Kaushik., Ren, L. P., Tu, King N., Coumou, David J., Biltoft, Peter., Howard, Charles., Mack, Chris A., Graf, Michael., Zhang, Peng., Lai, Shouliang., Solzbacher, Florian., McInerney, Edward J., Ramdani, Jamal., Vaccari, Giovanni., Ritzdorf, Tom., Klocke, John., Dyer, Timothy S., Machamer, Andrew., Blair, Donald W., Arai, Kazuhisa., Kobayashi, Yoshikazu., Otani, Hideaki., Tonnies, Dietrich., Topper, Michael., Wang, Zhong L., Huff, Michael A., Liu, David N., Curcie, Wayne D., Sweeney, Joseph D., Cox, James C., Cavicchi, Kristin., Barsness, Dan., Gould, Charles K., Albrecht, David J., Li, Bo., Carriker, Wayne., Haris, Clint., Peltinov, Ram., Menaker, Mina., Scibilia, Bruno., Altis, Yoan Dupret., McCafferty, Robert H., Davis, Brett J., Trammell, Steven R., Pavlotsky, Richard V., Beck, Stephen C., Gendreau, Michael., Amick, Hal., Levit, Larry., Muller, Chris., Kochevar, Steven., Gromala, Jerry., Pinkowski, Richard E., IDC Corporation.

وصف الملف: text

Other Title: How semiconductor chips are made.
IC design.
Silicon substrates for semiconductor manufacturing.
Copper, low-k dielectrics, and their reliability.
Fundamentals of silicide formation on Si.
Plasma process control.
Vacuum technology.
Photomask.
Microlithography.
Ion implantation and rapid thermal processing.
Wet etching.
Plasma etching.
Physical vapor deposition.
Chemical vapor deposition.
Epitaxy.
ECD fundamentals.
Chemical mechanical polishing.
Wet cleaning.
Inspection, measurement, and test.
Grinding, stress relief, and dicing.
Packaging.
Nanotechnology and nanomanufacturing.
Fundamentals of microelectromechanical systems.
Flat-panel display technology and manufacturing.
Specialty gas and CDA systems.
Waste gas abatement systems.
PFC abatement.
Chemical and slurry handling systems.
Fluid handling components for high-purity liquid chemicals and slurries.
Fundamentals of ultrapure water.
Yield management.
Automated material handling system.
CD metrology and CD-SEM.
Six sigma.
Advanced process control.
Environmental, health, and safety considerations in semiconductor fabrication facilities.
Plan, design, and construction of a fab.
Cleanroom design and construction.
Micro-vibration and noise design.
ESD controls in cleanroom environments.
Airborne molecular contamination.
Particle monitoring in semiconductor manufacturing.
Wastewater neutralization systems.

Relation: Electronic reproduction. New York, N.Y. : McGraw Hill, 2005. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.

الإتاحة: https://www.accessengineeringlibrary.com/content/book/9780071445597