المساهمون: Tummala, Rao R., 1942-, Morris, James E., Davidson, Evan., Sarma, D. H. R., Hubbard, Bob., Rao, N. J., Swaminathan, Madhavan., Peterson, Andrew F., Kim, Juongho., Sitaraman, Suresh K., Pang, John H. L., Bar-Cohen, Avram., Watwe, Abhay., Seetharamu, Kankanhally N., Kamath, Sundar M., Charles, Harry K., Baldwin, David F., Garrou, Phil., Prymak, John., Bhattacharya, Swapan., Paik, Kyung., Cruz Rivera, Jose L., Gaylord, Thomas K., Glytsis, Elias N., Laskar, Joy., Tentzeris, Emmanouil M., Schutt-Aine, Jose E., Ramesham, Rajeshuni., Ghaffarian, Reza., Ayazi, Farrokh., Wong, C. P., Fang, Treliant., Varadarajan, Mahesh., Illyefalvi-Vitez, Zsolt., ZImmermann, Joachim., Mattsson, Fredrik., Kandelid, Stefan., Raj, Pulugurtha Markondeya., Liu, Johan., Ohlckers, Per., Keezer, David., Kim, Bruce., Koppolu, Sasidhar., May, Gary S., Shinotani, Ken-ichi., Malmodin, Jens., Trankell, Richard., Qu, Jianmin., Guo, Yifan.

وصف الملف: text

Other Title: Introduction to microsystems packaging.
Role of packaging in microelectronics.
Role of packaging in microsystems.
Fundamentals of electrical package design.
Fundamentals of design for reliability.
Fundamentals of thermal management.
Fundamentals of single chip packaging.
Fundamentals of multichip packaging.
Fundamentals of IC assembly.
Fundamentals of wafer-level packaging.
Fundamentals of passives : discrete, integrated, and embedded.
Fundamentals of optoelectronics.
Fundamentals of RF packaging.
Fundamentals of microelectromechanical systems.
Fundamentals of sealing and encapsulation.
Fundamentals of system-level PWB technologies.
Fundamentals of board assembly.
Fundamentals of packaging materials and processes.
Fundamentals of electrical testing.
Fundamentals of package manufacturing.
Fundamentals of microsystems design for environment.
Fundamentals of microsystems reliability.

Relation: Electronic reproduction. New York, N.Y. : McGraw Hill, 2001. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.

الإتاحة: https://www.accessengineeringlibrary.com/content/book/9780071371698