نتائج البحث - "Jin, Hang"

1

دورية أكاديمية

An Improved Sparse Representation Based on Local Orthogonal Matching Pursuit for Bearing Compound Fault Diagnosis.

المؤلفون: Yi, Cai, Ran, Le, Tang, Jiayin, Jin, Hang, Zhuang, Zhe, Zhou, Qiuyang, Lin, Jianhui

المصدر: IEEE Sensors Journal; 11/15/2022, Vol. 22 Issue 22, p21911-21923, 13p

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2

دورية أكاديمية

Hierarchical Attention-Based Machine Learning Model for Radiation Prediction of WB-BGA Package.

المؤلفون: Jin, Hang, Gu, Zhe-Ming, Tao, Tuo-Min, Erping, Li

المصدر: IEEE Transactions on Electromagnetic Compatibility; Dec2021, Vol. 63 Issue 6, p1972-1980, 9p

مصطلحات موضوعية: ELECTROMAGNETIC interference, MACHINE learning, CONVOLUTIONAL neural networks, PREDICTION models, ELECTRONIC packaging, ELECTRIC fields

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3

دورية

Circuit Modeling for RRAM-Based Neuromorphic Chip Crossbar Array With and Without Write-Verify Scheme.

المؤلفون: Tao, Tuomin, Ma, Hanzhi, Chen, Quankun, Gu, Zhe-Ming, Jin, Hang, Ahmed, Manareldeen, Tan, Shurun, Wang, Aili, Liu, En-Xiao, Li, Er-Ping

المصدر: IEEE Transactions on Circuits & Systems. Part I: Regular Papers; May2021, Vol. 68 Issue 5, p1906-1916, 11p

مصطلحات موضوعية: NONVOLATILE random-access memory, INTEGRATED circuit interconnections, DOMAIN decomposition methods, WEIGHT training, CIRCUIT elements, BIOLOGICAL neural networks

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4

دورية أكاديمية

Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning.

المؤلفون: Li, Yong-Sheng, Yu, Huan, Jin, Hang, Sarvey, Thomas E., Oh, Hanju, Bakir, Muhannad S., Swaminathan, Madhavan, Li, Er-Ping

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Jul2019, Vol. 9 Issue 7, p1244-1252, 9p

مصطلحات موضوعية: THREE-dimensional integrated circuits, MACHINE learning, ARTIFICIAL neural networks, INTEGRATED circuit design, COOLING, MATHEMATICAL optimization

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5

دورية أكاديمية

A Novel Package Lid Using Mushroom-Type EBG Structures for Unintentional Radiation Mitigation.

المؤلفون: Yang, Xiao-Li, Zhang, Le, Li, Yong-Sheng, Jin, Hang, Cheng, Ping, Li, Yan, Li, Er-Ping

المصدر: IEEE Transactions on Electromagnetic Compatibility; Dec2018, Vol. 60 Issue 6, p1882-1888, 7p

مصطلحات موضوعية: ELECTROMAGNETIC devices, ELECTRONIC packaging, INTEGRATED circuits, ELECTRICAL engineering, DIELECTRIC materials, COMPLEMENTARY metal oxide semiconductors

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6

دورية أكاديمية

ESD Spark Behavior and Modeling for Geometries Having Spark Lengths Greater Than the Value Predicted by Paschen's Law.

المؤلفون: Zhou, Jianchi, Gan, Yingjie, Jin, Hang, Pommerenke, David

المصدر: IEEE Transactions on Electromagnetic Compatibility; Feb2018, Vol. 60 Issue 1, p115-121, 7p

مصطلحات موضوعية: FINITE geometries, ELECTRODES, ELECTRIC conductivity, ELECTRIC currents, ELECTROSTATIC discharges

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7

مؤتمر

Computed tomography of transverse mesocolon: Involvement in gastric carcinoma.

المؤلفون: Dong, Peng, Wang, Xi-zhen, Li, Jin, Chen, Hua-cheng, Jin, Hang

المصدر: 2012 5th International Conference on BioMedical Engineering & Informatics; 2012, p251-255, 5p

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8

مؤتمر

Brands leaping and bounding based on disruptive innovation — A case study of FAW own brand Pentium.

المؤلفون: Xue-ying Yang, Jun-feng Bai, Jin-hang Liu

المصدر: 2011 IEEE 18Th International Conference on Industrial Engineering & Engineering Management (IE&EM); 2011, p1841-1845, 5p

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9

مؤتمر

Statically balanced walking of a crawler robot.

المؤلفون: Parasuraman, S., Foo Jin Hang

المصدر: 2011 IEEE Instrumentation & Measurement Technology Conference (I2MTC); 2011, p1-6, 6p

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10

مؤتمر

Treat Shrimp Wastewater with Compound Photosynthetic Bacteria.

المؤلفون: Jin Hang, Zhao Yu, Lei Xiaochun, Xue Guoxin, Tang Yanjun, He Yixin

المصدر: 2011 International Conference on Computer Distributed Control & Intelligent Environmental Monitoring (CDCIEM); 2011, p2352-2355, 4p

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