يعرض 1 - 10 نتائج من 13 نتيجة بحث عن '"temperature reduction"', وقت الاستعلام: 1.46s تنقيح النتائج
  1. 1
    مؤتمر
    A simulation study on novel clay secondary walling system for indoor cooling: a performance assessment

    المؤلفون: Sriskandaraja, Viveha, Rajapaksha, Malthi, Halwathura, Rangika, Jayasinghe, Guttila Yugantha

    المصدر: 2022 Moratuwa Engineering Research Conference (MERCon) Engineering Research Conference (MERCon), 2022 Moratuwa. :1-6 Jul, 2022

    Relation: 2022 Moratuwa Engineering Research Conference (MERCon)

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  2. 2
    مؤتمر
    Building envelope integrated phase change material under hot climate towards efficient energy and CO2 emission saving

    المؤلفون: Al-Yasiri, Qudama, Szabo, Marta

    المصدر: 2022 7th International Conference on Smart and Sustainable Technologies (SpliTech) Smart and Sustainable Technologies (SpliTech), 2022 7th International Conference on. :1-6 Jul, 2022

    Relation: 2022 7th International Conference on Smart and Sustainable Technologies (SpliTech)

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  3. 3
    دورية أكاديمية
    A PWM Method of H-Bridge Converter With Temperature Rise Balancing and Minimization Based on Periodically Alternating Employment of Power Devices

    المؤلفون: Wang, C., Tian, C., Cheng, H., Deng, J.

    المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 37(9):11135-11151 Sep, 2022

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  4. 4
    مؤتمر
    Device Temperature Reduction Methodology with a New Layout Drawing Technique for Ultra-thin FET

    المؤلفون: Jin, Minhyun, Kim, Soo Youn, Song, Minkyu

    المصدر: 2021 IEEE Region 10 Symposium (TENSYMP) Region 10 Symposium (TENSYMP), 2021 IEEE. :1-4 Aug, 2021

    Relation: 2021 IEEE Region 10 Symposium (TENSYMP)

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  5. 5
    مؤتمر
    Improving Cooling Performance of Gas Conditioning Towers/Downcomers to Reduce Plant Emissions

    المؤلفون: P.E, Robert Van Durme, P.E, Marek Serafin

    المصدر: 2021 IEEE-IAS/PCA Cement Industry Conference (IAS/PCA) Cement Industry Conference (IAS/PCA), 2021 IEEE-IAS/PCA. :1-4 May, 2021

    Relation: 2021 IEEE-IAS/PCA Cement Industry Conference (IAS/PCA)

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  6. 6
    مؤتمر
    Evaluating Design Space Subsetting for Multi-Objective Optimization in Configurable Systems

    المؤلفون: Alsafrjalani, Mohamad Hammam, Adegbija, Tosiron, Ramamoorthi, Lokesh

    المصدر: 20th International Symposium on Quality Electronic Design (ISQED) Quality Electronic Design (ISQED), 20th International Symposium on. :104-109 Mar, 2019

    Relation: 2019 20th International Symposium on Quality Electronic Design (ISQED)

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  7. 7
    مؤتمر
    The effect of surface Bulk Air Cooler water flow on deep-level mine temperatures

    المؤلفون: Brand, H. G., Kleingeld, M., Mare, P., Schutte, A. J.

    المصدر: 2017 International Conference on the Industrial and Commercial Use of Energy (ICUE) Industrial and Commercial Use of Energy (ICUE), 2017 International Conference on the. :1-6 Aug, 2017

    Relation: 2017 International Conference on the Industrial and Commercial Use of Energy (ICUE)

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  8. 8
    مؤتمر
    Improving the die utilization and lifetime in a multi-die SiC power module by means of integrated per-die gate buffers

    المؤلفون: Ewanchuk, J., Brandelero, J., Mollov, S.

    المصدر: 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) Power Semiconductor Devices and IC's (ISPSD), 2017 29th International Symposium on. :439-442 May, 2017

    Relation: 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)

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  9. 9
    مؤتمر
    Integration of metallic phase change material in power electronics

    المؤلفون: Soupremanien, U., Szambolics, H., Quenard, S., Bouchut, P., Roumanie, M., Bottazzini, R., Dunoyer, N.

    المصدر: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on. :125-133 May, 2016

    Relation: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  10. 10
    مؤتمر
    Thermal-Aware Test Data Compression Using Dictionary Based Coding

    المؤلفون: Karmakar, Rajit, Chattopadhyay, Santanu

    المصدر: 2015 28th International Conference on VLSI Design VLSI Design (VLSID), 2015 28th International Conference on. :53-58 Jan, 2015

    Relation: 2015 28th International Conference on VLSI Design (VLSID)

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