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المؤلفون: B. Porth, Philippe M. Vereecken, Thomas J. Mcdevitt, C. Johnson, Jennifer C. Robbins, T. Rutkowski, M. Wenner, J. Gambino, Erick G. Walton, Stephen E. Luce, Kenneth Lawrence Devries, D. Rath, Jonathan D. Chapple-Sokol
المصدر: 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
مصطلحات موضوعية: Materials science, fungi, Metallurgy, technology, industry, and agriculture, Copper interconnect, chemistry.chemical_element, macromolecular substances, Copper, Cathode, Corrosion, law.invention, Anode, stomatognathic system, chemistry, law, Etching (microfabrication), Dry etching, Reactive-ion etching
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1e412f1a769f28f4127f9d445a5c9407
https://doi.org/10.1109/ipfa.2008.4588209