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المؤلفون: C. Bunel, P. Descours, M. Pommier, N. David, G. Parat, R. Franiatte, S. Yon, S. Borel, B. Goubault, Gilles Simon
المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
مصطلحات موضوعية: Wire bonding, business.product_category, Materials science, business.industry, Electrical engineering, Stacking, law.invention, Capacitor, Lead frame, Stack (abstract data type), law, Hardware_INTEGRATEDCIRCUITS, Die (manufacturing), Quad Flat No-leads package, business, Lead (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::66a2747a11556a2910b16f33d640c02c
https://doi.org/10.1109/eptc.2015.7412370