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المؤلفون: M. Cartier, A. Rouzaud, J-C. Souriau, Gilles Simon, Jean Brun, G. Pares
المصدر: International Symposium on Microelectronics. 2016:000139-000143
مصطلحات موضوعية: Engineering, business.industry, Size reduction, Electrical engineering, Volume (computing), Wearable computer, Manufacturing engineering, Low volume, Reliability (semiconductor), Material structure, Order (exchange), Automotive Engineering, business, Wearable technology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::78739b1a7139a09234fd974cf0d28533
https://doi.org/10.4071/isom-2016-wa11 -
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المؤلفون: F. Schnegg, C. Karoui, G. Klug, Gilles Simon, H. Luesebrink, R. Anciant, K. Martinschitz, A. Attard, G. Parès, F. De Crecy, A. N'hari, D. Cruau
المصدر: International Symposium on Microelectronics. 2012:000710-000719
مصطلحات موضوعية: Materials science, business.product_category, business.industry, Stacking, Nanotechnology, Topology (electrical circuits), Chip, Silicon interposer, Reduction (complexity), Face (geometry), Automotive Engineering, Optoelectronics, Die (manufacturing), business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ea5801701485e2ebc0d7025c4b12e415
https://doi.org/10.4071/isom-2012-wa61 -
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المؤلفون: Kei Murayama, Robert Cuchet, Gilles Simon, Mitsuhiro Aizawa, Masahiro Sunohara, H. Feldis, Jean Charbonnier, Myriam Assous, Jean-Philippe Bally, Mitsutoshi Higashi, Ken Miyairi
المصدر: International Symposium on Microelectronics. 2012:000984-000990
مصطلحات موضوعية: Materials science, Through-silicon via, Silicon, business.industry, Copper interconnect, chemistry.chemical_element, Substrate (electronics), Die (integrated circuit), chemistry, Automotive Engineering, Process integration, Interposer, Electronic engineering, Optoelectronics, Redistribution layer, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::73ac4947910caa691ab8377c513c6e99
https://doi.org/10.4071/isom-2012-wp63