المؤلفون: Anna Zhang, Hui Liu, Changqing Liu, Xu Guan, Zheng Zhou, Fengshun Wu

المصدر: Journal of Electronic Materials. 49:6214-6222

مصطلحات موضوعية: 010302 applied physics, Exothermic reaction, Fusion, Materials science, NanoFoil, Alloy, chemistry.chemical_element, 02 engineering and technology, engineering.material, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Microstructure, 01 natural sciences, Grain size, Electronic, Optical and Magnetic Materials, chemistry, Soldering, 0103 physical sciences, Materials Chemistry, engineering, Electrical and Electronic Engineering, Composite material, 0210 nano-technology, Tin

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4c0a9b79593e6df94c336b06a89719bf
https://doi.org/10.1007/s11664-020-08363-9

المؤلفون: Changqing Liu, Bing An, Yiping Wu, Zhiwen Chen

المصدر: Journal of Electronic Materials. 44:4836-4845

مصطلحات موضوعية: Materials science, Solid-state physics, Diffusion, Metallurgy, Intermetallic, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Planar, Free surface, Soldering, Materials Chemistry, Perpendicular, Growth rate, Electrical and Electronic Engineering, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3c67932986b1737779ec5f0cc5420bca
https://doi.org/10.1007/s11664-015-4043-7

المؤلفون: Changqing Liu, Zhiwen Chen, Yiping Wu, Bing An, Longzao Zhou

المصدر: Journal of Electronic Materials. 44:4058-4064

مصطلحات موضوعية: Materials science, Solid-state physics, Metallurgy, Intermetallic, chemistry.chemical_element, Condensed Matter Physics, Block (periodic table), Copper, Isothermal process, Electronic, Optical and Magnetic Materials, chemistry, Soldering, Materials Chemistry, Electrical and Electronic Engineering, Joint (geology), Layer (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::70bb5ae0f1c324d4c29c03202c42569c
https://doi.org/10.1007/s11664-015-3979-y

المؤلفون: Mark Ashworth, R. J. Heath, Rebecca L. Higginson, Changqing Liu, Geoffrey Wilcox

المصدر: Journal of Electronic Materials. 43:1005-1016

مصطلحات موضوعية: Materials science, Diffusion barrier, Metallurgy, Oxide, chemistry.chemical_element, Zinc, equipment and supplies, Condensed Matter Physics, Tin oxide, Electronic, Optical and Magnetic Materials, Brass, chemistry.chemical_compound, chemistry, Whisker, visual_art, Materials Chemistry, visual_art.visual_art_medium, Electrical and Electronic Engineering, Tin, Electroplating

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d77a76087dd540f0a8fe170c92f0fa2e
https://doi.org/10.1007/s11664-014-2983-y

المؤلفون: Changqing Liu, David A. Hutt, Yingtao Tian, Bob Stevens

المصدر: Journal of Electronic Materials. 43:594-603

مصطلحات موضوعية: Interconnection, White light interferometry, Materials science, business.industry, Metallurgy, Direct current, chemistry.chemical_element, Condensed Matter Physics, Microstructure, Electronic, Optical and Magnetic Materials, chemistry, Materials Chemistry, Bumping, Optoelectronics, Wafer, Electrical and Electronic Engineering, Electroplating, business, Indium

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ac07f93b548ca3d02ce55da90e6a29d0
https://doi.org/10.1007/s11664-013-2891-6

المؤلفون: Zhiyong Wu, Zhiheng Huang, Paul Conway, Hua Xiong, Changqing Liu

المصدر: Journal of Electronic Materials. 42:263-271

مصطلحات موضوعية: Microstructural evolution, Work (thermodynamics), Fabrication, Materials science, Solid-state physics, Condensed Matter Physics, Microstructure, Electronic, Optical and Magnetic Materials, Reliability (semiconductor), Materials Chemistry, von Mises yield criterion, Electrical and Electronic Engineering, Composite material, Stress concentration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bffe9cd3bdd5147310eb09fca99cb508
https://doi.org/10.1007/s11664-012-2201-8

المؤلفون: Changqing Liu, Jicheng Gong, Paul Conway, Vadim V. Silberschmidt

المصدر: Journal of Electronic Materials. 38:2429-2435

مصطلحات موضوعية: Shearing (physics), Materials science, Metallurgy, Alloy, Intermetallic, engineering.material, Condensed Matter Physics, Focused ion beam, Electronic, Optical and Magnetic Materials, Materials Chemistry, engineering, Grain boundary, Electrical and Electronic Engineering, Dislocation, Eutectic system, Tensile testing

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::787d188ee092b3dbce3393d9cb9d6afc
https://doi.org/10.1007/s11664-009-0871-7

المؤلفون: Dezhi Li, Changqing Liu, Paul Conway

المصدر: Journal of Electronic Materials. 35:388-398

مصطلحات موضوعية: Materials science, Kirkendall effect, Diffusion, Metallurgy, Intermetallic, Condensed Matter Physics, Microstructure, Electronic, Optical and Magnetic Materials, Shear (sheet metal), Soldering, Materials Chemistry, Shear strength, Electrical and Electronic Engineering, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d8e609f9af1694e4a1ae6b7c3a8551a4
https://doi.org/10.1007/bf02690524

المؤلفون: Hui Xu, Changqing Liu, Silberschmidt, Vadim V., Zhong Chen

المصدر: Journal of Electronic Materials; Jan2010, Vol. 39 Issue 1, p124-131, 8p, 18 Black and White Photographs, 3 Charts, 3 Graphs

مصطلحات موضوعية: COPPER wire, ALUMINUM, SCANNING electron microscopy, INTERMETALLIC compounds, TRANSMISSION electron microscopy, DIFFUSION bonding (Metals)

المؤلفون: Jicheng Gong, Conway, Paul P., Changqing Liu, Silberschmidt, Vadim V.

المصدر: Journal of Electronic Materials; Dec2009, Vol. 38 Issue 12, p2429-2435, 7p, 13 Black and White Photographs, 1 Graph

مصطلحات موضوعية: ALLOYS, EUTECTICS, MELTING points, INTERMETALLIC compounds