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1
المؤلفون: Valerie Eveloy, Peter Rodgers, M.S.J. Hashmi
المصدر: Journal of Electronic Packaging. 127:67-75
مصطلحات موضوعية: Physics, Turbulence, Turbulence modeling, Reynolds number, Reynolds stress, Computer Science Applications, Electronic, Optical and Magnetic Materials, Computational physics, Open-channel flow, Flow separation, symbols.namesake, Mechanics of Materials, Inviscid flow, symbols, Fluid dynamics, Electrical and Electronic Engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a438a977333e3be8515f000d514ba674
https://doi.org/10.1115/1.1849234 -
2
المؤلفون: O. J. Ilegbusi
المصدر: Journal of Electronic Packaging. 118:250-257
مصطلحات موضوعية: Materials science, K-epsilon turbulence model, Turbulence, Turbulence modeling, Reynolds number, Mechanics, K-omega turbulence model, Two-fluid model, Computer Science Applications, Electronic, Optical and Magnetic Materials, Physics::Fluid Dynamics, symbols.namesake, Classical mechanics, Mechanics of Materials, Turbulence kinetic energy, Heat transfer, symbols, Electrical and Electronic Engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f55511ce0ba0d77c58b04a6b285ac900
https://doi.org/10.1115/1.2792160 -
3
المؤلفون: C. Y. Lee, Yi Hsuan Hung, Meng-Chyi Wu, C. H. Peng, Y. M. Kuo, C. J. Fang
المصدر: Journal of Electronic Packaging. 129:400-410
مصطلحات موضوعية: Jet (fluid), Materials science, Turbulence, Thermodynamics, Reynolds number, Mechanics, Nusselt number, Computer Science Applications, Electronic, Optical and Magnetic Materials, Physics::Fluid Dynamics, symbols.namesake, Heat flux, Mechanics of Materials, Combined forced and natural convection, Heat transfer, symbols, Transient (oscillation), Electrical and Electronic Engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fbbbbd2eac8c33e1f932e83ceb281d27
https://doi.org/10.1115/1.2804087 -
4
المؤلفون: Egidio Marotta, Carlos Silva, Leroy S. Fletcher
المصدر: Journal of Electronic Packaging. 129:157-166
مصطلحات موضوعية: Dynamic scraped surface heat exchanger, Engineering, Turbulence, business.industry, Enhanced heat transfer, Mechanical engineering, Laminar flow, Heat sink, Nusselt number, Computer Science Applications, Electronic, Optical and Magnetic Materials, Open-channel flow, Mechanics of Materials, Dimple, Heat transfer, Plate fin heat exchanger, Electrical and Electronic Engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ac3696923baac8677ec986f0667294b9
https://doi.org/10.1115/1.2721087 -
5
المؤلفون: Daniel Rundström, Bahram Moshfegh
المصدر: Journal of Electronic Packaging. 128:150-156
مصطلحات موضوعية: Jet (fluid), Materials science, Turbulence, Airflow, Flow (psychology), Thermodynamics, Heat transfer coefficient, Mechanics, Dissipation, Computer Science Applications, Electronic, Optical and Magnetic Materials, Open-channel flow, Physics::Fluid Dynamics, Mechanics of Materials, Heat transfer, Water cooling, Electronics cooling, Electrical and Electronic Engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::80edec63f389bba89f3e0c267a4014f4
https://doi.org/10.1115/1.2188948 -
6
المؤلفون: Dae Hee Lee, P. M. Ligrani, Y. S. Chung
المصدر: Journal of Electronic Packaging. 127:106-112
مصطلحات موضوعية: Physics, Flow visualization, business.industry, Turbulence, Nozzle, Reynolds number, Computer Science Applications, Electronic, Optical and Magnetic Materials, Vortex, symbols.namesake, Optics, Classical mechanics, Pedestal, Mechanics of Materials, Heat transfer, symbols, Jet impingement, Electrical and Electronic Engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3a1ae40afa899adadab2dd4abddd6df2
https://doi.org/10.1115/1.1849235 -
7
المؤلفون: Robert J. Moffat
المصدر: Journal of Electronic Packaging. 126:501-509
مصطلحات موضوعية: Materials science, Computer cooling, business.industry, Turbulence, Heat transfer coefficient, Mechanics, Computational fluid dynamics, Thermal conduction, Computer Science Applications, Electronic, Optical and Magnetic Materials, Coolant, Mechanics of Materials, Heat transfer, Electrical and Electronic Engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::980e3ad46a22a6eee5f0a7f0bd0ea7f8
https://doi.org/10.1115/1.1827265 -
8
المؤلفون: Tunc Icoz, Yogesh Jaluria
المصدر: Journal of Electronic Packaging. 126:465-471
مصطلحات موضوعية: Optimal design, Engineering, Computer cooling, Computer simulation, Turbulence, business.industry, Mechanical engineering, Control engineering, Computer Science Applications, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Heat transfer, Water cooling, Design process, Electrical and Electronic Engineering, business, Design methods, Versa, Simulation
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bf1080d70fc8ab6a1011ebb902a487b0
https://doi.org/10.1115/1.1827262 -
9
المؤلفون: Roger R. Schmidt, Ethan E. Cruz
المصدر: Journal of Electronic Packaging. 126:510-518
مصطلحات موضوعية: geography, Engineering, geography.geographical_feature_category, Turbulence, business.industry, Flow (psychology), Computational fluid dynamics, Inlet, Computer Science Applications, Electronic, Optical and Magnetic Materials, Rack, Mechanics of Materials, visual_art, Raised floor, visual_art.visual_art_medium, Data center, Tile, Electrical and Electronic Engineering, business, Simulation, Marine engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c87806dcbcb28089c42fa666e491a366
https://doi.org/10.1115/1.1827266 -
10
المؤلفون: Issam Mudawar, Weilin Qu
المصدر: Journal of Electronic Packaging. 126:213-224
مصطلحات موضوعية: Pressure drop, Materials science, Convective heat transfer, Chemistry, Turbulence, Thermodynamics, Laminar flow, Mechanics, Heat sink, Slug flow, Computer Science Applications, Electronic, Optical and Magnetic Materials, Physics::Fluid Dynamics, Mechanics of Materials, Boiling, Heat transfer, Two-phase flow, Electrical and Electronic Engineering, Transport phenomena, Nucleate boiling
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7e33ac7969a84f42f92a4c82df41916a
https://doi.org/10.1115/1.1756145