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1Microstructure and Mechanical Characteristic of Nano-WC Composite Coating Prepared by Laser Cladding
المؤلفون: Yeo Jian Hua, Kong Fan Zhi, Zhang Wei, Zhang Qun Li
المصدر: Solid State Phenomena. 118:579-584
مصطلحات موضوعية: Diffraction, Materials science, Abrasion (mechanical), engineering.material, Condensed Matter Physics, Microstructure, Indentation hardness, Hardness, Atomic and Molecular Physics, and Optics, law.invention, Coating, law, Nano, engineering, General Materials Science, Composite material, Electron microscope
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::62df517e028edda0e0581e723740859e
https://doi.org/10.4028/www.scientific.net/ssp.118.579 -
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المؤلفون: Zhang Wei, Yeo Jian Hua, Zhang Qun Li, Gao Ming Xia
المصدر: Solid State Phenomena. 118:585-590
مصطلحات موضوعية: Diffraction, Materials science, Metallurgy, Alloy, technology, industry, and agriculture, chemistry.chemical_element, Iron–nickel alloy, engineering.material, Condensed Matter Physics, Microstructure, Indentation hardness, Atomic and Molecular Physics, and Optics, law.invention, Metal, Chromium, chemistry, law, visual_art, engineering, visual_art.visual_art_medium, General Materials Science, Electron microscope
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c1136b9bbae1d2df7a7c9e4a280d8662
https://doi.org/10.4028/www.scientific.net/ssp.118.585 -
3
المؤلفون: Cheng Bo, Gao Xia, Wang Li, Wolfgang Kempe, Xie Xiao-Ming, Zhang Qun
المصدر: Soldering & Surface Mount Technology. 15:15-20
مصطلحات موضوعية: Engineering, business.industry, Delamination, Electronic packaging, Structural engineering, Condensed Matter Physics, Stress (mechanics), Reliability (semiconductor), Soldering, General Materials Science, Electrical and Electronic Engineering, Composite material, business, Failure mode and effects analysis, Joint (geology), Flip chip
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المؤلفون: Xie Xiao-Ming, Zhang Qun, Wang Li, Cheng Bo, Gao Xia, Wolfgang Kempe
المصدر: Soldering & Surface Mount Technology. 15:27-32
مصطلحات موضوعية: Engineering, Thermal shock, business.industry, Fracture mechanics, Condensed Matter Physics, Stress (mechanics), Cracking, Reliability (semiconductor), Soldering, Fracture (geology), Electronic engineering, General Materials Science, Electrical and Electronic Engineering, Composite material, business, Flip chip