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المؤلفون: Huck Beng Chew, Tianfu Guo, Li Cheng
المصدر: 2006 8th Electronics Packaging Technology Conference.
مصطلحات موضوعية: Shear (sheet metal), Cracking, education.field_of_study, Materials science, Population, Electronic packaging, Adhesive, Composite material, education, Failure mode and effects analysis, Intensity (heat transfer), Necking
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::313121a109a521389e83e27f74c32d35
https://doi.org/10.1109/eptc.2006.342812