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1
المؤلفون: John Bell, Laura Redmond, Kalind Carpenter, Jean-Pierre de la Croix
المصدر: Journal of Microelectronics and Electronic Packaging. 19:25-38
مصطلحات موضوعية: Computer Networks and Communications, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4e857c835401ec4c095002e78c6649b5
https://doi.org/10.4071/imaps.1655356 -
2
المؤلفون: Müller, Jonas, Letz, Sebastian A., Flaviu-Bogdan, Simon, Bayer, Christoph F., Schletz, Andreas, Görlich, Jens, Nishimura, Takatoshi
المساهمون: Publica
المصدر: Journal of Microelectronics and Electronic Packaging. 19:18-24
مصطلحات موضوعية: FEM, power electronics packaging, silver sintering, Computer Networks and Communications, printed circuit board, Electrical and Electronic Engineering, die bonding, GaN package, HEMT, nanoscale sintering paste, Numerical analysis, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d3b2024990c780171f4ee808f45c1a54
https://doi.org/10.4071/imaps.1675410 -
3
المؤلفون: Kappert, Holger, Braun, Sebastian, Kordas, Norbert, Kosfeld, Andre, Utz, Alexander, Weber, Constanze, Rämer, Olaf, Spanier, Malte, Ihle, Martin, Ziesche, Steffen, Kokozinski, Rainer
المساهمون: Publica
المصدر: Journal of Microelectronics and Electronic Packaging. 19:1-7
مصطلحات موضوعية: high temperature, chipset, flip chip, Computer Networks and Communications, sensor readout electronics, system assembly, Hardware_INTEGRATEDCIRCUITS, SOI CMOS, Hardware_PERFORMANCEANDRELIABILITY, Electrical and Electronic Engineering, Elektrotechnik, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7ef3dc88a07f9d0f567ed4439c5dcada
https://doi.org/10.4071/imaps.1547377 -
4
المؤلفون: Raed Al Athamneh, Francy Akkara, Sa'd Hamasha
المصدر: Journal of Microelectronics and Electronic Packaging. 19:39-47
مصطلحات موضوعية: Computer Networks and Communications, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3f11803ea1f80160ca50c1baf4e007af
https://doi.org/10.4071/imaps.1665996 -
5
المؤلفون: Michael Grimm, David DeWire, Hua Xia, Nelson Settles, Gaery Rutherford
المصدر: Journal of Microelectronics and Electronic Packaging. 18:161-167
مصطلحات موضوعية: Computer science, Computer Networks and Communications, Logging, Pharmacology (medical), Electrical and Electronic Engineering, Failure mode and effects analysis, Reliability (statistics), Reliability engineering, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8130175ee457de527e1dcdde21b6a544
https://doi.org/10.4071/imaps.1545580 -
6
المصدر: Journal of Microelectronics and Electronic Packaging. 18:168-176
مصطلحات موضوعية: Computer Networks and Communications, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::32c725029e89d1aed356b359a9463aea
https://doi.org/10.4071/imaps.1545724 -
7
المؤلفون: Vishnu V. B. Reddy, Jaimal Williamson, Suresh K. Sitaraman
المصدر: Journal of Microelectronics and Electronic Packaging. 18:183-189
مصطلحات موضوعية: Computer Networks and Communications, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5ec915eccac9e661701a41e1b4f1c793
https://doi.org/10.4071/imaps.1501802 -
8
المؤلفون: John H Lau
المصدر: International Symposium on Microelectronics. 2021:000049-000059
مصطلحات موضوعية: Computer Networks and Communications, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::36bae2fd5e8e4e26fef5458a6417e03a
https://doi.org/10.4071/1085-8024-2021.1.000049 -
9
المؤلفون: Andrej Novikov, Mathias Nowottnick
المصدر: Journal of Microelectronics and Electronic Packaging. 19
مصطلحات موضوعية: Computer Networks and Communications, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0109f1a626182cf27795d694d6c74a44
https://doi.org/10.4071/001c.57716 -
10
المؤلفون: Angelika Hable, Paul Tabatabai, Hannah L. Lichtenegger, Anton Scherr, Thomas Krivec, Dieter P. Gruber
المصدر: Journal of Microelectronics and Electronic Packaging. 19
مصطلحات موضوعية: Computer Networks and Communications, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::158387b3ca5399e760ce321cc81160e3
https://doi.org/10.4071/001c.57717