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المؤلفون: Huck Beng Chew, Li Cheng, W.G. Cheong, Tianfu Guo
المصدر: IEEE Transactions on Components and Packaging Technologies. 32:12-19
مصطلحات موضوعية: Cracking, Materials science, Vapor pressure, Ball grid array, Thermal, Constitutive equation, Electronic packaging, Thermomechanical analysis, Electrical and Electronic Engineering, Composite material, Finite element method, Electronic, Optical and Magnetic Materials