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1
المؤلفون: Kiyokazu Yasuda
المصدر: Journal of The Japan Institute of Electronics Packaging. 22:395-399
مصطلحات موضوعية: Materials science, business.industry, System integration, Nanotechnology, Ultrasonic bonding, Electrical and Electronic Engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fedc12253660f928cc9b26edc671d5cc
https://doi.org/10.5104/jiep.22.395 -
2
المؤلفون: Yoshihisa Katoh
المصدر: Journal of Japan Institute of Electronics Packaging. 20:135-139
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, Mechanical engineering, 02 engineering and technology, 01 natural sciences, Engineering physics, 020210 optoelectronics & photonics, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, System integration, Center (algebra and category theory), Electrical and Electronic Engineering, business, Research center
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::053f413ad1c7be5945bb799b1bd3eefe
https://doi.org/10.5104/jiep.20.135 -
3
المؤلفون: Akira Matsuzawa
المصدر: Journal of Japan Institute of Electronics Packaging. 8:536-541
مصطلحات موضوعية: Computer science, business.industry, Systems engineering, System integration, Electrical and Electronic Engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ba9f120e876e37de59ec162f88d53eff
https://doi.org/10.5104/jiep.8.536 -
4
المؤلفون: Tadatomo Suga, Otsuka Kanji
المصدر: Journal of Japan Institute of Electronics Packaging. 3:621-626
مصطلحات موضوعية: Computer science, business.industry, Systems engineering, System integration, Electrical and Electronic Engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2eb4551b5ea65c9a567f90bc466e8bec
https://doi.org/10.5104/jiep.3.621 -
5
المؤلفون: Toshihiro Miyake
المصدر: Journal of Japan Institute of Electronics Packaging. 19:P7-P7
مصطلحات موضوعية: Engineering, Computer-integrated manufacturing, Electronic instrument, business.industry, Integrated Computer-Aided Manufacturing, System integration, Electrical and Electronic Engineering, business, Manufacturing engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e56d044fb3334b74b2e9b7ec920cafcc
https://doi.org/10.5104/jiep.19.p7