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المؤلفون: Li Cheng, Huck Beng Chew, Tianfu Guo
المصدر: Moisture Sensitivity of Plastic Packages of IC Devices ISBN: 9781441957184
مصطلحات موضوعية: Coalescence (physics), Reflow soldering, Printed circuit board, Materials science, Residual stress, Nucleation, Adhesive, Molding (process), Composite material, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ceef2bf91e581c87d176f06aa07bfd51
https://doi.org/10.1007/978-1-4419-5719-1_12