المؤلفون: Beliaeva, A. S., Polschikova, O. V., Sudarev, A. A.

المصدر: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF) Wave Electronics and its Application in Information and Telecommunication Systems (WECONF), 2024. :1-5 Jun, 2024

Relation: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF)

المؤلفون: Liu, Jay Guoxu, Liang, Xin, Zhao, Yulei, Yan, Chris Chunhui

المصدر: 2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS), 2023 20th China International Forum on. :398-403 Nov, 2023

Relation: 2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)

المؤلفون: Geng, Chong, Zhang, Shuang, Yuan, Yaqian, Liu, Jay Guoxu, Xu, Shu

المصدر: 2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS), 2023 20th China International Forum on. :394-397 Nov, 2023

Relation: 2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)

المؤلفون: Osharovska, Olena, Patlayenko, Mikola, Solodka, Valentina

المصدر: 2023 31st National Conference with International Participation (TELECOM) International Participation (TELECOM), 2023 31st National Conference with. :1-4 Nov, 2023

Relation: 2023 31st National Conference with International Participation (TELECOM)

المؤلفون: Kim, Joonsoo, Jnawali, Kamal, Liu, Chenguang

المصدر: 2023 IEEE International Conference on Image Processing (ICIP) Image Processing (ICIP), 2023 IEEE International Conference on. :1065-1069 Oct, 2023

Relation: 2023 IEEE International Conference on Image Processing (ICIP)

المؤلفون: Li, Huailin, Zhao, Hanxiang, Liu, Mengnan, Wu, Ningzhou, Zheng, Yuanlin

المصدر: 2023 IEEE 18th Conference on Industrial Electronics and Applications (ICIEA) Industrial Electronics and Applications (ICIEA), 2023 IEEE 18th Conference on. :1909-1914 Aug, 2023

Relation: 2023 IEEE 18th Conference on Industrial Electronics and Applications (ICIEA)

المؤلفون: Kao, Wen-Chung, Hsu, Yi-Cheng, Hong, Kai-Dun, Ying, Ren-Xiang

المصدر: 2024 IEEE International Conference on Consumer Electronics (ICCE) Consumer Electronics (ICCE), 2024 IEEE International Conference on. :1-2 Jan, 2024

Relation: 2024 IEEE International Conference on Consumer Electronics (ICCE)

المؤلفون: Liu, Ying-Tsang, Li, Yun-Li

المصدر: 2023 30th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) Active-Matrix Flatpanel Displays and Devices (AM-FPD), 2023 30th International Workshop on. :1-3 Jul, 2023

Relation: 2023 30th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)

المؤلفون: Tazehmahaleh, Kaveh Ahmadian, Farahani, Esmat Kishani, Godazgar, Hamideh, Smet, Kevin A. G., Hanselaer, Peter

المصدر: 2021 Joint Conference - 11th International Conference on Energy Efficiency in Domestic Appliances and Lighting & 17th International Symposium on the Science and Technology of Lighting (EEDAL/LS:17) Energy Efficiency in Domestic Appliances and Lighting & 17th International Symposium on the Science and Technology of Lighting (EEDAL/LS:17),2021 Joint Conference - 11th International Conference on. :1-6 Jun, 2022

Relation: 2021 Joint Conference - 11th International Conference on Energy Efficiency in Domestic Appliances and Lighting & 17th International Symposium on the Science and Technology of Lighting (EEDAL/LS:17)

المؤلفون: Cheng, Yuanjie, Lo, Jeffery C. C., Qiu, Xing, Xu, Hua, Tao, Mian, Lee, S. W. Ricky

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :135-136 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)