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1مؤتمر
المؤلفون: Ling, Feng, Dan, Yufeng, Wan, Changhua, Cai, Kevin, Sen, Bidyut
المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :683-687 Jul, 2023
Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
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2دورية أكاديمية
المؤلفون: Kim, Heegon, Sui, Chunchun, Cai, Kevin, Sen, Bidyut, Fan, Jun
المصدر: IEEE Transactions on Electromagnetic Compatibility; Dec2018, Vol. 60 Issue 6, p1648-1654, 7p
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3دورية أكاديمية
المؤلفون: Kim, Heegon, Sui, Chunchun, Cai, Kevin, Sen, Bidyut, Fan, Jun
المصدر: IEEE Transactions on Electromagnetic Compatibility; Dec2018, Vol. 60 Issue 6, p2049-2052, 4p