المؤلفون: Yalin Ran, Xiaole Cui, Xiaoyan Xu, Xiaoxin Cui, Yufeng Jin

المصدر: 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2016 IEEE MTT-S International Microwave Workshop Series on. :1-3 Jul, 2016

Relation: 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

المؤلفون: Xin Sun, Runiu Fang, Huan Liu, Min Miao, Yufeng Jin

المصدر: 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2016 IEEE MTT-S International Microwave Workshop Series on. :1-3 Jul, 2016

Relation: 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

المؤلفون: Xin Sun, Ming Ji, Shenglin Ma, Yunhui Zhu, Wenping Kang, Min Miao, Yufeng Jin

المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :77-80 Aug, 2010

Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Min Miao, Huan Liu, Yufeng Jin, Runiu Fang

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:749-762

مصطلحات موضوعية: 010302 applied physics, Through-silicon via, Computer science, 020206 networking & telecommunications, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit, 01 natural sciences, Capacitance, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, law.invention, law, Microsystem, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Systems design, Cost benefit, Electrical and Electronic Engineering, Analysis method

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0b1bcb658d6027f93ecdab43858fdb03
https://doi.org/10.1109/tcpmt.2020.2985204

المؤلفون: Yang Yang, Min Miao, Xiaole Cui, Huan Liu, Yufeng Jin

المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

مصطلحات موضوعية: 010302 applied physics, Void (astronomy), Materials science, Scattering, Acoustics, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, 02 engineering and technology, Full wave analysis, 01 natural sciences, Capacitance, 020202 computer hardware & architecture

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3a5c853e0b6ead2c6877f24000a30d48
https://doi.org/10.1109/icept47577.2019.245163

المؤلفون: Jing Chen, Qinghua Zeng, Yufeng Jin

المصدر: IEEE Transactions on Device and Materials Reliability. 17:708-712

مصطلحات موضوعية: 010302 applied physics, Coupling, Materials science, Through-silicon via, 010308 nuclear & particles physics, business.industry, Oxide, Radiation, 01 natural sciences, Capacitance, Computer Science::Other, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, Reliability (semiconductor), chemistry, Percolation, 0103 physical sciences, Optoelectronics, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Voltage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c176a7f605eba37498d0804f8f4c3567
https://doi.org/10.1109/tdmr.2017.2749640

المؤلفون: Qinghua Zeng, Jing Chen, Yufeng Jin

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Thermal oxidation, Materials science, Silicon, Through-silicon via, business.industry, chemistry.chemical_element, 02 engineering and technology, 01 natural sciences, Capacitance, 020202 computer hardware & architecture, law.invention, Capacitor, Hysteresis, Reliability (semiconductor), chemistry, law, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, business, Voltage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8ae4664ff433fa35f503416b917189af
https://doi.org/10.1109/ectc.2019.00316

المؤلفون: Yufeng Jin, Xin Sun, Runiu Fang, Min Miao

المصدر: IEEE Transactions on Electron Devices. 62:4161-4168

مصطلحات موضوعية: Coupling, Admittance, Materials science, Differential capacitance, business.industry, Hardware_PERFORMANCEANDRELIABILITY, Substrate (electronics), Condensed Matter::Mesoscopic Systems and Quantum Hall Effect, Capacitance, Signal, Electronic, Optical and Magnetic Materials, Hardware_INTEGRATEDCIRCUITS, Interposer, Electronic engineering, Optoelectronics, Work function, Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c00b3838f3a84b04a9fcf0d30b13ffda
https://doi.org/10.1109/ted.2015.2494538

المؤلفون: Min Miao, Huan Liu, Runiu Fang, Yufeng Jin, Xin Sun

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Materials science, Silicon, Through-silicon via, business.industry, Doping, chemistry.chemical_element, Transmission-line matrix method, Solid modeling, 01 natural sciences, Capacitance, chemistry, 0103 physical sciences, Optoelectronics, Redistribution (chemistry), business, Parametric statistics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::20580fe5fd9422b6c7f132ce4a84dfd4
https://doi.org/10.1109/ectc.2018.00322

المؤلفون: Yong Guan, Yufeng Jin, Shuwei He, Jing Chen, Wei Wang, Shenglin Ma, Jiwei Li, Huan Liu, Liulin Hu

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Fabrication, Materials science, Equivalent series resistance, business.industry, 020208 electrical & electronic engineering, Biasing, 02 engineering and technology, 01 natural sciences, Capacitance, law.invention, Atomic layer deposition, Capacitor, law, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Interposer, Optoelectronics, Breakdown voltage, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::170ae72a2e99b76fab8f107a94808669
https://doi.org/10.1109/ectc.2018.00296