يعرض 1 - 9 نتائج من 9 نتيجة بحث عن '"ultrashallow junctions"', وقت الاستعلام: 0.85s تنقيح النتائج
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    المساهمون: MESA+ Institute, Integrated Devices and Systems

    المصدر: Shivakumar, D T, Knežević, T & Nanver, L K 2021, ' Nanometer-thin pure boron CVD layers as material barrier to Au or Cu metallization of Si ', Journal of Materials Science: Materials in Electronics, vol. 32, no. 6, pp. 7123-7135 . https://doi.org/10.1007/s10854-021-05422-7
    Journal of Materials Science: Materials in Electronics, 32(6), 7123-7135. Springer

    وصف الملف: application/pdf

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    المؤلفون: Vittorio Privitera

    المصدر: Current opinion in solid state & materials science 6 (2002): 55–65. doi:10.1016/S1359-0286(02)00007-4
    info:cnr-pdr/source/autori:Privitera V./titolo:Ultra-low energy ion implantation of boron for future silicon devices/doi:10.1016%2FS1359-0286(02)00007-4/rivista:Current opinion in solid state & materials science/anno:2002/pagina_da:55/pagina_a:65/intervallo_pagine:55–65/volume:6

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