-
1
المؤلفون: G. Imbert, Laetitia Castagne, Gilles Simon, F. Casset, Pascal Chevalier, N. Chevrier, B. Kholti, L. Toffanin, Sébastien Petitdidier, F. Bailly, Jp. Pierrel, D. Mermin, R. Franiatte, C. Ferrandon
المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: Stress (mechanics), Substrate (building), Yield (engineering), Materials science, Silicon, chemistry, Stacking, Electronic engineering, chemistry.chemical_element, Wafer, Dielectric, Composite material, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5850f68bc6ecd5229641ea5556d1a7a1
https://doi.org/10.1109/estc.2016.7764485