يعرض 1 - 9 نتائج من 9 نتيجة بحث عن '"Sen, Bidyut"', وقت الاستعلام: 0.82s تنقيح النتائج
  1. 1
    مؤتمر
    Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis

    المؤلفون: Li, Chaofeng, Cai, Kevin, Ouyang, Muqi, Mathew, Manish Kizhakkeveettil, Mousav, Mehdi, Sen, Bidyut, Kim, DongHyun

    المصدر: 2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC) Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC), 2023 Joint Asia-Pacific International Symposium on. :1-4 May, 2023

    Relation: 2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC)

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  2. 2
    مؤتمر
    An Investigation on Multiple Reflections and Group Delay Behavior in High-Speed System Designs

    المؤلفون: Ouyang, Muqi, Pu, Bo, Cai, Kevin, Gao, Anna, Penugonda, Srinath, Liu, Liang, Sen, Bidyut, Kim, DongHyun

    المصدر: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium EMC/SI/PI and EMC Europe Symposium, 2021 IEEE International Joint. :423-428 Jul, 2021

    Relation: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

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  3. 3
    مؤتمر
    Automated 3D discontinuity optimization with speed sensitivity for high-speed Serdes channels

    المؤلفون: Dong, Qian, Cai, Kevin, Gao, Anna, Sen, Bidyut

    المصدر: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium EMC/SI/PI and EMC Europe Symposium, 2021 IEEE International Joint. :977-981 Jul, 2021

    Relation: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

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  4. 4
    مؤتمر
    A Novel 4-Port S-Parameter De-Skew Method in Frequency Domain for High-Speed Channel Design

    المؤلفون: Gao, Qian, Cai, Kevin, Sen, Bidyut

    المصدر: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020 IEEE International Symposium on. :103-107 Jul, 2020

    Relation: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  5. 5
    مؤتمر
    Generic Modeling of Differential Striplines Using Machine Learning Based Regression Analysis

    المؤلفون: Penugonda, Srinath, Yong, Shaohui, Gao, Anna, Cai, Kevin, Sen, Bidyut, Fan, Jun

    المصدر: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020 IEEE International Symposium on. :226-230 Jul, 2020

    Relation: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  6. 6
    مؤتمر
    Dielectric Material and Foil Surface Roughness Properties Extraction Based on Single-ended Measurements and Phase Constant ($\beta$) Fitting

    المؤلفون: Yong, Shaohui, Khilkevich, Victor, Penugonda, Srinath, Cai, Xiao-Ding, Gao, Qian, Sen, Bidyut, Gao, Han, Yanagawa, Douglas, Padilla, Darja, Hinaga, Scott, Drewniak, James, Fan, Jun

    المصدر: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020 IEEE International Symposium on. :346-351 Jul, 2020

    Relation: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  7. 7
    مؤتمر
    Estimating the via-plane capacitance for differential vias with shared-antipad based on analytical equations

    المؤلفون: Zhang, Ying, Wang, Yansheng, Xu, Jun, Sui, Chunchun, Sen, Bidyut, Jin, Shuai, Fan, Jun

    المصدر: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :272-276 Aug, 2017

    Relation: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  8. 8
    مؤتمر
    A survey on modeling strategies for high-speed differential Via between two parallel plates

    المؤلفون: Xu, Jun, Wang, Yansheng, Zhang, Ying, Sui, Chunchun, Sen, Bidyut, Jin, Shuai, Fan, Jun

    المصدر: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :527-531 Aug, 2017

    Relation: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  9. 9
    مؤتمر
    Automated Full-Board SI Scan for High-Speed Applications up to 112Gb/s and Beyond

    المؤلفون: Cai, Kevin, Gao, Anna, Sen, Bidyut, Wan, Joshua, Ling, Feng

    المصدر: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium EMC/SI/PI and EMC Europe Symposium, 2021 IEEE International Joint. :429-429 Jul, 2021

    Relation: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

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