المؤلفون: Yong, Shaohui, Cai, Kevin, Sen, Bidyut, Fan, Jun, Khilkevich, Victor, Sui, Chunchun

المصدر: 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018 IEEE Symposium on. :538-543 Jul, 2018

Relation: 2018 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

المؤلفون: Zhang, Ying, Wang, Yansheng, Xu, Jun, Sui, Chunchun, Sen, Bidyut, Jin, Shuai, Fan, Jun

المصدر: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :272-276 Aug, 2017

Relation: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

المؤلفون: Xu, Jun, Wang, Yansheng, Zhang, Ying, Sui, Chunchun, Sen, Bidyut, Jin, Shuai, Fan, Jun

المصدر: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :527-531 Aug, 2017

Relation: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

المؤلفون: Ren, Fanghui, Cai, Kevin, Sui, Chunchun, Balachandran, Jayaprakash, Sen, Bidyut

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :2249-2255 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Jiang, Wei, Cai, Xiao-Ding, Sen, Bidyut, Wang, Guoan

المصدر: IEEE Transactions on Electromagnetic Compatibility; Apr2019, Vol. 61 Issue 2, p548-557, 10p

مصطلحات موضوعية: MICROSTRIP transmission lines, PARAMETER estimation, ELECTRIC inductance, ELECTRIC capacity, NUMERICAL solutions to equations, COMPUTER simulation