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المؤلفون: Michel Bosman, A. Ranjan, Sean J. O’Shea, Nagarajan Raghavan, Kin Leong Pey
المصدر: ACS Applied Materials & Interfaces. 12:55000-55010
مصطلحات موضوعية: Stress (mechanics), Materials science, Dielectric strength, Graphene, law, Percolation, Breakdown voltage, General Materials Science, Dielectric, Chemical vapor deposition, Composite material, Thermal conduction, law.invention
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المؤلفون: Nagarajan Raghavan, K. L. Pey, S. Mei, Sean J. O’Shea, Michel Bosman, A. Ranjan, K. Shubhakar
المصدر: Microelectronics Reliability. 64:204-209
مصطلحات موضوعية: 010302 applied physics, Resistive touchscreen, Materials science, business.industry, Electrical engineering, 02 engineering and technology, Dielectric, Conductive atomic force microscopy, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Amorphous solid, Resistive random-access memory, Percolation, 0103 physical sciences, Optoelectronics, Grain boundary, Crystallite, Electrical and Electronic Engineering, 0210 nano-technology, Safety, Risk, Reliability and Quality, business
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المؤلفون: Nagarajan Raghavan, Kin Leong Pey, Michel Bosman, Sean J. O’Shea, K. Shubhakar, A. Ranjan, R. Thamankar, O. A. Neucheva, Yee Chong Loke
المصدر: Microelectronics Reliability. 55:1450-1455
مصطلحات موضوعية: Materials science, business.industry, Nanotechnology, Dielectric, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Stack (abstract data type), Percolation, Optoelectronics, Nanometre, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Nanoscopic scale, Electrical conductor, Nanoprobing, High-κ dielectric
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المؤلفون: Michel Bosman, Nagarajan Raghavan, Daniel D. Frey, Kin Leong Pey
المصدر: Microelectronics Reliability. 55:1422-1426
مصطلحات موضوعية: Materials science, Markov process, Condensed Matter Physics, Markov model, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Resistive random-access memory, symbols.namesake, Reliability (semiconductor), Percolation, Statistics, symbols, State (computer science), Kinetic Monte Carlo, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Low resistance
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المؤلفون: Michel Bosman, S. Mei, Nagarajan Raghavan, K. L. Pey, Sean J. O’Shea, K. Shubhakar, A. Ranjan
المصدر: IRPS
مصطلحات موضوعية: 010302 applied physics, Materials science, Dielectric strength, chemistry.chemical_element, 02 engineering and technology, Dielectric, Substrate (electronics), 021001 nanoscience & nanotechnology, 01 natural sciences, chemistry, Percolation, 0103 physical sciences, Breakdown voltage, Composite material, 0210 nano-technology, Spectroscopy, Boron, Electrical conductor
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bc8b560713d0f89d0d3adb5ea90f7c79
https://doi.org/10.1109/irps.2018.8353574 -
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المؤلفون: Nagarajan Raghavan, Michel Bosman, K. L. Pey, K. Shubhakar, S. Mei
المصدر: 2016 IEEE International Reliability Physics Symposium (IRPS).
مصطلحات موضوعية: 010302 applied physics, Materials science, Multiphysics, Nucleation, 02 engineering and technology, Mechanics, Dielectric, 021001 nanoscience & nanotechnology, 01 natural sciences, Finite element method, Stack (abstract data type), Percolation, 0103 physical sciences, Electronic engineering, Grain boundary, Kinetic Monte Carlo, 0210 nano-technology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b1a6515e799f25f642fb0ea5a7a63f4e
https://doi.org/10.1109/irps.2016.7574574 -
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المؤلفون: A. Ranjan, Sean J. O’Shea, Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, Joel Molina, K. Shubhakar, R. Thamankar
المصدر: 2016 IEEE International Reliability Physics Symposium (IRPS).
مصطلحات موضوعية: 010302 applied physics, Materials science, Condensed matter physics, Triple point, Analytical chemistry, 02 engineering and technology, Dielectric, 021001 nanoscience & nanotechnology, 01 natural sciences, Percolation, Metastability, Vacancy defect, 0103 physical sciences, Breakdown voltage, Grain boundary, 0210 nano-technology, Spectroscopy
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9fbc49463aaf71fa6b8fe27609bc5848
https://doi.org/10.1109/irps.2016.7574576 -
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المؤلفون: Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, Daniel D. Frey
المصدر: IRPS
مصطلحات موضوعية: Protein filament, Materials science, business.industry, Percolation, Monte Carlo method, Quantum point contact, Electrical engineering, Mechanics, Kinetic Monte Carlo, business, Reset (computing), Voltage, Resistive random-access memory
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::402775d8631a5605e03311ec8afb9fbd
https://doi.org/10.1109/irps.2015.7112743 -
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المؤلفون: Nagarajan Raghavan, Kin Leong Pey, Michel Bosman
المصدر: IRPS
مصطلحات موضوعية: Logarithmic scale, Stress (mechanics), Spatial correlation, Materials science, Dielectric strength, Condensed matter physics, Percolation, Analytical chemistry, Time-dependent gate oxide breakdown, SILC, Dielectric
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e04230b84d3e1d145aa4307ef6e488b4
https://doi.org/10.1109/irps.2015.7112738 -
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المؤلفون: Nagarajan Raghavan, Michel Bosman, Wenhu Liu, Kin Leong Pey, Xiang Li, Thomas Kauerauf, Xing Wu
المصدر: IEEE Electron Device Letters. 32:252-254
مصطلحات موضوعية: Materials science, Passivation, business.industry, Circuit design, Electrical engineering, chemistry.chemical_element, Oxygen, Electronic, Optical and Magnetic Materials, Reliability (semiconductor), chemistry, Percolation, Logic gate, Electrode, Optoelectronics, Electrical and Electronic Engineering, business, High-κ dielectric