يعرض 1 - 5 نتائج من 5 نتيجة بحث عن '"Sen, Bidyut"', وقت الاستعلام: 0.87s تنقيح النتائج
  1. 1
    مؤتمر
    Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis

    المؤلفون: Li, Chaofeng, Cai, Kevin, Ouyang, Muqi, Mathew, Manish Kizhakkeveettil, Mousav, Mehdi, Sen, Bidyut, Kim, DongHyun

    المصدر: 2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC) Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC), 2023 Joint Asia-Pacific International Symposium on. :1-4 May, 2023

    Relation: 2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC)

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  2. 2
    مؤتمر
    Automated 3D discontinuity optimization with speed sensitivity for high-speed Serdes channels

    المؤلفون: Dong, Qian, Cai, Kevin, Gao, Anna, Sen, Bidyut

    المصدر: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium EMC/SI/PI and EMC Europe Symposium, 2021 IEEE International Joint. :977-981 Jul, 2021

    Relation: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

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  3. 3
    مؤتمر
    A Novel 4-Port S-Parameter De-Skew Method in Frequency Domain for High-Speed Channel Design

    المؤلفون: Gao, Qian, Cai, Kevin, Sen, Bidyut

    المصدر: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020 IEEE International Symposium on. :103-107 Jul, 2020

    Relation: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  4. 4
    مؤتمر
    Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

    المؤلفون: Ling, Feng, Cai, Kevin, Sen, Bidyut

    المصدر: 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018 IEEE Symposium on. :122-125 Jul, 2018

    Relation: 2018 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  5. 5
    مؤتمر
    A survey on modeling strategies for high-speed differential Via between two parallel plates

    المؤلفون: Xu, Jun, Wang, Yansheng, Zhang, Ying, Sui, Chunchun, Sen, Bidyut, Jin, Shuai, Fan, Jun

    المصدر: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :527-531 Aug, 2017

    Relation: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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