يعرض 1 - 7 نتائج من 7 نتيجة بحث عن '"Sen, Bidyut"', وقت الاستعلام: 0.80s تنقيح النتائج
  1. 1
    مؤتمر
    Machine-Learning-Based Optimization of Tx Equalization Parameters of a High-Speed Channel

    المؤلفون: Ling, Feng, Dan, Yufeng, Wan, Changhua, Cai, Kevin, Sen, Bidyut

    المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :683-687 Jul, 2023

    Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)

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  2. 2
    مؤتمر
    Optimizing the Placement of Non-Functional Pads on Signal Vias Using Multiple Reflection Analysis

    المؤلفون: Ouyang, Muqi, Cai, Kevin, Li, Chaofeng, Gao, Anna, Fu, Felen, Bian, Hannah, Sen, Bidyut, Kim, DongHyun

    المصدر: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022 IEEE International Symposium on. :169-174 Aug, 2022

    Relation: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  3. 3
    مؤتمر
    Automated 3D discontinuity optimization with speed sensitivity for high-speed Serdes channels

    المؤلفون: Dong, Qian, Cai, Kevin, Gao, Anna, Sen, Bidyut

    المصدر: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium EMC/SI/PI and EMC Europe Symposium, 2021 IEEE International Joint. :977-981 Jul, 2021

    Relation: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

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  4. 4
    مؤتمر
    A Novel 4-Port S-Parameter De-Skew Method in Frequency Domain for High-Speed Channel Design

    المؤلفون: Gao, Qian, Cai, Kevin, Sen, Bidyut

    المصدر: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020 IEEE International Symposium on. :103-107 Jul, 2020

    Relation: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  5. 5
    مؤتمر
    Dielectric Material and Foil Surface Roughness Properties Extraction Based on Single-ended Measurements and Phase Constant ($\beta$) Fitting

    المؤلفون: Yong, Shaohui, Khilkevich, Victor, Penugonda, Srinath, Cai, Xiao-Ding, Gao, Qian, Sen, Bidyut, Gao, Han, Yanagawa, Douglas, Padilla, Darja, Hinaga, Scott, Drewniak, James, Fan, Jun

    المصدر: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020 IEEE International Symposium on. :346-351 Jul, 2020

    Relation: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  6. 6
    مؤتمر
    Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

    المؤلفون: Ling, Feng, Cai, Kevin, Sen, Bidyut

    المصدر: 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018 IEEE Symposium on. :122-125 Jul, 2018

    Relation: 2018 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

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  7. 7
    مؤتمر
    Effective and Efficient Modeling of Differential Vias Using Semi-Empirical Approach

    المؤلفون: Ren, Fanghui, Cai, Kevin, Sui, Chunchun, Balachandran, Jayaprakash, Sen, Bidyut

    المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :2249-2255 May, 2017

    Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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