يعرض 1 - 2 نتائج من 2 نتيجة بحث عن '"Ronald D. Goldblatt"', وقت الاستعلام: 1.42s تنقيح النتائج
  1. 1
    200 mm wafer-scale integration of sub-20 nm sacrificial nanofluidic channels for manipulating and imaging single DNA molecules

    المؤلفون: M. Guillorn, Deqiang Wang, Steve Rossnagel, Lynne Gignac, Qinghuang Lin, Sung-Wook Nam, Ajay K. Royyuru, Robert L. Bruce, Gustavo Stolovitzky, P. J. Litwinowicz, Armand Galan, Dirk Pfeiffer, Evan G. Colgan, Ronald D. Goldblatt, S. Papa Rao, J.J. Bucchignano, Markus Brink, Michael F. Lofaro, Chao Wang, W. H. Advocate, Elizabeth A. Duch, E. Kratschmer, C. M. Breslin, John M. Cotte, William Henry Price, Christopher V. Jahnes, Stas Polonsky, Hongbo Peng, Eric A. Joseph

    المصدر: 2013 IEEE International Electron Devices Meeting.

    مصطلحات موضوعية: Materials science, Wafer-scale integration, Silicon, technology, industry, and agriculture, chemistry.chemical_element, Nanofluidics, Nanotechnology, Lab-on-a-chip, law.invention, chemistry.chemical_compound, chemistry, Optical microscope, law, Fluorescence microscope, Molecule, DNA

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7009e4a7a92742f8a8752e24815c32d7
    https://doi.org/10.1109/iedm.2013.6724627

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  2. 2
    A high performance 90nm SOI technology with 0.992 μm/sup 2/ 6T-SRAM cell

    المؤلفون: W. Lai, Steven J. Holmes, Werner A. Rausch, Allen H. Gabor, Karl Paul Muller, Colin J. Brodsky, Ernest Y. Wu, Jeffrey J. Welser, Sujatha Sankaran, Ricardo A. Donaton, S. Wu, Ronald A. DellaGuardia, S.K.H. Fung, W. Yan, S.H. Ku, Steven W. Mittl, Anthony I. Chou, A. Vayshenker, J. Snare, Paul D. Agnello, Len Y. Tsou, Mukesh Khare, Michael A. Gribelyuk, Renee T. Mo, Robert J. Purtell, F. Jamin, P.A. McFarland, Akihisa Sekiguchi, D. Nielsen, D. Wehella-Gamage, Ronald D. Goldblatt, E. Barth, Richard A. Ferguson, Tina Wagner, Dominic J. Schepis, Shreesh Narasimha, Woo-Hyeong Lee, Bruce B. Doris, Percy V. Gilbert, Stephen E. Greco, X. Chen, Sadanand V. Deshpande, Yujun Li

    المصدر: Digest. International Electron Devices Meeting.

    مصطلحات موضوعية: Interconnection, Materials science, Silicon, business.industry, Gate dielectric, Copper interconnect, Electrical engineering, Silicon on insulator, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit design, Dielectric, Stack (abstract data type), chemistry, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, business

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a76288235c918aa108b3bc11283b3430
    https://doi.org/10.1109/iedm.2002.1175865

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