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المؤلفون: G. Parat, Stephan Borel, M. Pommier, P. Nicolas, Gilles Simon, C. Bunel, S. Yon, P. Descours, R. Franiatte, B. Goubault
المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:001948-001966
مصطلحات موضوعية: Materials science, Silicon, business.industry, Electrical engineering, Stacking, chemistry.chemical_element, Capacitance, law.invention, Capacitor, chemistry, law, Electronic engineering, Breakdown voltage, Pharmacology (medical), Electronics, business, Decoupling (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aa890c15e1353f95c873d8c9d34dae0f
https://doi.org/10.4071/2016dpc-tha21 -
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المؤلفون: G. Imbert, Laetitia Castagne, Gilles Simon, F. Casset, Pascal Chevalier, N. Chevrier, B. Kholti, L. Toffanin, Sébastien Petitdidier, F. Bailly, Jp. Pierrel, D. Mermin, R. Franiatte, C. Ferrandon
المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: Stress (mechanics), Substrate (building), Yield (engineering), Materials science, Silicon, chemistry, Stacking, Electronic engineering, chemistry.chemical_element, Wafer, Dielectric, Composite material, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5850f68bc6ecd5229641ea5556d1a7a1
https://doi.org/10.1109/estc.2016.7764485 -
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المؤلفون: F. Schnegg, C. Karoui, G. Klug, Gilles Simon, H. Luesebrink, R. Anciant, K. Martinschitz, A. Attard, G. Parès, F. De Crecy, A. N'hari, D. Cruau
المصدر: International Symposium on Microelectronics. 2012:000710-000719
مصطلحات موضوعية: Materials science, business.product_category, business.industry, Stacking, Nanotechnology, Topology (electrical circuits), Chip, Silicon interposer, Reduction (complexity), Face (geometry), Automotive Engineering, Optoelectronics, Die (manufacturing), business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ea5801701485e2ebc0d7025c4b12e415
https://doi.org/10.4071/isom-2012-wa61 -
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المؤلفون: C. Bunel, P. Descours, M. Pommier, N. David, G. Parat, R. Franiatte, S. Yon, S. Borel, B. Goubault, Gilles Simon
المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
مصطلحات موضوعية: Wire bonding, business.product_category, Materials science, business.industry, Electrical engineering, Stacking, law.invention, Capacitor, Lead frame, Stack (abstract data type), law, Hardware_INTEGRATEDCIRCUITS, Die (manufacturing), Quad Flat No-leads package, business, Lead (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::66a2747a11556a2910b16f33d640c02c
https://doi.org/10.1109/eptc.2015.7412370 -
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المؤلفون: Sophie Verrun, Remy Franiatte, Vincent Mandrillon, Antoine Nowodzinski, Romain Anciant, Herve Boutry, Gilles Simon
المصدر: 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG).
مصطلحات موضوعية: Interconnection, Electrical resistance and conductance, Computer science, Compatibility (mechanics), Electronic engineering, Stacking, Wafer, Temperature cycling, Chip, Wafer-level packaging, Automotive engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::67de20174e4b6d8e85725e3a891be150
https://doi.org/10.1109/iscdg.2012.6359983