المؤلفون: Larsson, Jörgen, Johansson, Fredrik, 1973, Ivars, Diego Mas, Johnson, E., Flansbjer, M., Portal, N. W.

المصدر: Journal of Rock Mechanics and Geotechnical Engineering. 15(9):2209-2223

مصطلحات موضوعية: Three-dimensional (3D) scanning, Contact area measurements, Direct shear testing, Geometric quality assurance, Mechanical replicability, Replicas, Rock joint

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-338205
https://doi.org/10.1016/j.jrmge.2022.12.012

المؤلفون: Inoue, K., Okamoto, S., Akiyama, Y., Yamada, Y.

المصدر: IEEE Transactions on Haptics IEEE Trans. Haptics Haptics, IEEE Transactions on. 15(1):32-38 Jan, 2022

المؤلفون: Klymenko, S. A.^{Aff1, IDS1063457623050064_cor1}, Klymenko, S. An., Kopіeіkina, M. Yu., Manokhin, A. S., Melniychuk, Yu. O.

المصدر: Journal of Superhard Materials. 45(5):388-398

المؤلفون: Liu, Huifang^{Aff1, Aff3, IDs00170023120973_cor1}, Zhao, Dingrui, Chen, Xi, Chang, Yunlong^{Aff2, Aff3}, Yu, Xingfu, Li, An

المصدر: The International Journal of Advanced Manufacturing Technology. 128(5-6):2271-2283

المؤلفون: Chen, Jian, Zhang, Wangyang, Liu, Di, Wang, Chenglong, Zhu, Linbo^{Aff2, IDs122060230732y_cor5}

المصدر: Journal of Mechanical Science and Technology. 37(8):4159-4168

المؤلفون: Wang, M. T., Pang, Stella W.

المصدر: 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2021 IEEE 34th International Conference on. :513-516 Jan, 2021

Relation: 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Han, Jingyu, Song, Baojiang, Luo, Zhijun, Yan, Shanze

المصدر: 2021 International Conference on Electronics, Circuits and Information Engineering (ECIE) ECIE Electronics, Circuits and Information Engineering (ECIE), 2021 International Conference on. :131-135 Jan, 2021

Relation: 2021 International Conference on Electronics, Circuits and Information Engineering (ECIE)

المؤلفون: Zhang, X., Ren, W., Wang, S.

المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 68(9):8531-8539 Sep, 2021

المؤلفون: Behzad Golanbari, Aref Mardani

المصدر: Biomechanism and Bioenergy Research, Vol 2, Iss 2, Pp 56-64 (2023)

مصطلحات موضوعية: terramechanics, analytical model, traction force, soil stress, soil-tire interaction, contact area, Agriculture

وصف الملف: electronic resource

Relation: https://bbr.uk.ac.ir/article_4046_28dc237783318e1cd733a4e693e11ed9.pdf; https://doaj.org/toc/2821-1855

URL الوصول: https://doaj.org/article/a150292eec2d4e08bbbc153b124e72ef

المؤلفون: Chen, Ming, Bian, Qiang, Zeng, Guang, Zhao, Chunjiang^{Aff1, IDs40430023045301_cor4}, Jiang, Lianyun, Zhang, Xiangyun, Jiao, Bowen

المصدر: Journal of the Brazilian Society of Mechanical Sciences and Engineering. 45(12)