المؤلفون: Huck Beng Chew, Tianfu Guo, Li Cheng

المصدر: International Journal of Solids and Structures. 44(7-8):2553-2570

مصطلحات موضوعية: chemistry.chemical_classification, Coalescence (physics), Dilatant, Void (astronomy), Materials science, Polymers, Void growth, Mechanical Engineering, Applied Mathematics, Pressure-sensitive yielding, Plastic dilatancy, Polymer, Flow stress, Condensed Matter Physics, chemistry, Materials Science(all), Mechanics of Materials, Modeling and Simulation, Modelling and Simulation, Pressure sensitive, Discrete voids, General Materials Science, Adhesive, Composite material, Single layer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3be3c1bc52d3f3e6059685404bcb4119

المؤلفون: Shuman Xia, Jiangwei Wang, Scott X. Mao, Feifei Fan, Xueju Wang, Huck Beng Chew, Siyu Tao, Yang Liu, Haoran Wang, Avery Yang, Ting Zhu

المصدر: Nature Communications

مصطلحات موضوعية: Multidisciplinary, Materials science, Silicon, technology, industry, and agriculture, General Physics and Astronomy, chemistry.chemical_element, General Chemistry, Nanoindentation, General Biochemistry, Genetics and Molecular Biology, Article, Amorphous solid, Fracture toughness, chemistry, Ultimate tensile strength, Fracture (geology), Deformation (engineering), Composite material, Damage tolerance

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c82f6904c9d7629e30019c8471f6ac93
https://pubmed.ncbi.nlm.nih.gov/26400671

المؤلفون: Xueju Wang, Binyue Hou, Shuman Xia, Haoran Wang, Huck Beng Chew

المصدر: Nano letters. 15(3)

مصطلحات موضوعية: Materials science, Mechanical Engineering, Delamination, Bioengineering, General Chemistry, Current collector, Condensed Matter Physics, Atomic units, Chemical physics, Ab initio quantum chemistry methods, Phase (matter), Electrode, General Materials Science, Density functional theory, Fade

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::949fa0fa1439c3f7ad4d171a00f44f30
https://pubmed.ncbi.nlm.nih.gov/25647625

المؤلفون: Huck Beng Chew, Tianfu Guo, Li Cheng

المصدر: Thin Solid Films. 504:325-330

مصطلحات موضوعية: Void (astronomy), Materials science, Vapor pressure, Constitutive equation, Metals and Alloys, Surfaces and Interfaces, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Reflow soldering, Cracking, Oblate spheroid, Materials Chemistry, Adhesive, Thin film, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c504a646459c30c90ed9edbba966fddc
https://doi.org/10.1016/j.tsf.2005.09.054

المؤلفون: Bagchi, Soumendu, Harpale, Abhilash, Huck Beng Chew

المصدر: Proceedings of the Royal Society A: Mathematical, Physical & Engineering Sciences; Aug2018, Vol. 474 Issue 2216, p1-19, 19p

مصطلحات موضوعية: CARBON nanotubes, POLYMERIC nanocomposites, POLYMETHYLMETHACRYLATE, MOLECULAR dynamics, CROSSLINKING (Polymerization)

المؤلفون: Tianfu Guo, Huck Beng Chew, Li Cheng

المصدر: International Journal of Fracture. 134:349-368

مصطلحات موضوعية: Toughness, Fracture toughness, Materials science, Mechanics of Materials, Vapor pressure, Residual stress, Modeling and Simulation, Void (composites), Delamination, Computational Mechanics, Fracture mechanics, Adhesive, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4c45d95681f2e52311e45e1a7f7133c7
https://doi.org/10.1007/s10704-005-2427-z

المؤلفون: Huck Beng Chew, Li Cheng, Tianfu Guo

المصدر: International Journal of Solids and Structures. 42:4795-4810

مصطلحات موضوعية: Materials science, Vapor pressure, Applied Mathematics, Mechanical Engineering, Condensed Matter Physics, Reflow soldering, Cracking, Mechanics of Materials, Residual stress, Modeling and Simulation, General Materials Science, Adhesive, Composite material, Porosity, Failure mode and effects analysis, Water vapor

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d8bc2dbf94cff639a42c7eb4cd066ff0
https://doi.org/10.1016/j.ijsolstr.2005.01.012

المؤلفون: Li Cheng, Tianfu Guo, Huck Beng Chew

المصدر: Engineering Fracture Mechanics. 71:2435-2448

مصطلحات موضوعية: Toughness, Fracture toughness, Materials science, Mechanics of Materials, Vapor pressure, Residual stress, Mechanical Engineering, Void (composites), General Materials Science, Composite material, Strain hardening exponent, Porosity, Thermal expansion

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::054269a8f3023043b83ab9adfe7044b6
https://doi.org/10.1016/j.engfracmech.2004.01.005

المؤلفون: Ruizhi Li, Huck Beng Chew

المصدر: Proceedings of the 8th Pacific Rim International Congress on Advanced Materials and Processing ISBN: 9783319485867
PRICM: 8 Pacific Rim International Congress on Advanced Materials and Processing

مصطلحات موضوعية: Delocalized electron, Molecular dynamics, Compressive strength, Materials science, Metallurgy, Grain boundary, Slip (materials science), Dislocation, Composite material, Nanoscopic scale, Surface energy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bb0b2cdda31471dedb6e508f4881e65c
https://doi.org/10.1007/978-3-319-48764-9_247

المؤلفون: Chien-Kai Wang, Huck Beng Chew, Kyung-Suk Kim

المصدر: MRS Proceedings. 1297

مصطلحات موضوعية: Condensed Matter::Materials Science, Crystallography, Materials science, Condensed matter physics, Traction (engineering), Projection method, Nucleation, Grain boundary, Virtual work, Nanocrystalline material, Embedded atom model, Grain boundary strengthening

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b02705d7943971c9db3fcd30ab93b769
https://doi.org/10.1557/opl.2011.678