المؤلفون: Zhang, Jun, Fu, Dong Xu, Bian, Miaomiao, Cai, Xiao-Ding, Sen, Bidyut

المصدر: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2019 12th International Workshop on the. :61-63 Oct, 2019

Relation: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

المؤلفون: Penugonda, Srinath, Yong, Shaohui, Wang, Yansheng, Xu, Jun, Cai, Kevin, Sen, Bidyut, Fan, Jun

المصدر: 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), 2019 IEEE International Symposium on. :321-326 Jul, 2019

Relation: 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

المؤلفون: Ling, Feng, Cai, Kevin, Sen, Bidyut

المصدر: 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018 IEEE Symposium on. :122-125 Jul, 2018

Relation: 2018 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

المؤلفون: Yong, Shaohui, Cai, Kevin, Sen, Bidyut, Fan, Jun, Khilkevich, Victor, Sui, Chunchun

المصدر: 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018 IEEE Symposium on. :538-543 Jul, 2018

Relation: 2018 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

المؤلفون: Jiang, Wei, Cai, kevin, Sen, Bidyut, Wang, Guoan

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :2288-2294 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Zhang, Ying, Wang, Yansheng, Xu, Jun, Sui, Chunchun, Sen, Bidyut, Jin, Shuai, Fan, Jun

المصدر: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :272-276 Aug, 2017

Relation: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

المؤلفون: Xu, Jun, Wang, Yansheng, Zhang, Ying, Sui, Chunchun, Sen, Bidyut, Jin, Shuai, Fan, Jun

المصدر: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :527-531 Aug, 2017

Relation: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

المؤلفون: Cai, Kevin, Gao, Anna, Sen, Bidyut, Wan, Joshua, Ling, Feng

المصدر: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium EMC/SI/PI and EMC Europe Symposium, 2021 IEEE International Joint. :429-429 Jul, 2021

Relation: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

المؤلفون: Ren, Fanghui, Cai, Kevin, Sui, Chunchun, Balachandran, Jayaprakash, Sen, Bidyut

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :2249-2255 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chen, Jue, Sen, Bidyut

المصدر: 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on. :631-635 Aug, 2014

Relation: 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014