المؤلفون: Leite, Gabriela, Fontana, Marcele Elisa

المصدر: 2021 International Conference on Decision Aid Sciences and Application (DASA) Decision Aid Sciences and Application (DASA), 2021 International Conference on. :294-298 Dec, 2021

Relation: 2021 International Conference on Decision Aid Sciences and Application (DASA)

المؤلفون: Monjur, Mohammad Mezanur Rahman, Heacock, Joseph, Sun, Rui, Yu, Qiaoyan

المصدر: 2021 IEEE International Symposium on Technologies for Homeland Security (HST) Technologies for Homeland Security (HST), 2021 IEEE International Symposium on. :1-7 Nov, 2021

Relation: 2021 IEEE International Symposium on Technologies for Homeland Security (HST)

المؤلفون: Halsey, C., Depoy, J., Campbell, D.M., Ward, D.R., Anderson, E.M., Schmucker, S.W., Ivie, J.A., Gao, X., Scrymgeour, D.A., Misra, S.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(2):169-174 Jun, 2022

المؤلفون: Stornelli, Aldo, Simms, Christopher, Reim, Wiebke, Ozcan, Sercan

المصدر: Technovation. 130

مصطلحات موضوعية: Smart manufacturing, Advanced manufacturing, Dynamic capabilities, Technology providers, Innovation ecosystems, Innovation outcomes, Entreprenörskap och innovation, Entrepreneurship and Innovation

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-103986
https://doi.org/10.1016/j.technovation.2023.102925
https://ltu.diva-portal.org/smash/get/diva2:1832326/FULLTEXT01.pdf

المؤلفون: Hossein Omidian, Niloofar Babanejad

المصدر: Macromol, Vol 4, Iss 2, Pp 190-212 (2024)

مصطلحات موضوعية: bioinspired composites, sustainability, advanced manufacturing, multifunctional materials, environmental engineering, Chemical technology, TP1-1185, Biochemistry, QD415-436

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2673-6209/4/2/10; https://doaj.org/toc/2673-6209

URL الوصول: https://doaj.org/article/380eddc81d4d4236ac9ef12bb4aafe8f

المؤلفون: Rerucha, Simon, Hola, Miroslava, Sarbort, Martin, Kur, Jan, Konecny, Pavel, Lazar, Josef, Cip, Ondrej

المصدر: 2021 International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME) Electrical, Computer, Communications and Mechatronics Engineering (ICECCME), 2021 International Conference on. :1-5 Oct, 2021

Relation: 2021 International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME)

المؤلفون: Gao, Xujiao, Mendez, Juan P., Lu, Tzu-Ming, Anderson, Evan M., Campbell, DeAnna M., Ivie, Jeffrey A., Schmucker, Scott W., Grine, Albert, Lu, Ping, Tracy, Lisa A., Arghavani, Reza, Misra, Shashank

المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :102-106 Sep, 2021

Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Wang, G., Zhang, L.

المصدر: IEEE Engineering Management Review IEEE Eng. Manag. Rev. Engineering Management Review, IEEE. 50(1):113-131 Jan, 2022

المؤلفون: Munasinghe, Nuwan, Masangkay, John, Paul, Gavin

المصدر: 2021 IEEE International Conference on Robotics and Automation (ICRA) Robotics and Automation (ICRA), 2021 IEEE International Conference on. :7006-7012 May, 2021

Relation: 2021 IEEE International Conference on Robotics and Automation (ICRA)

المؤلفون: Hearn, Greg, Williams, Penny, Rodrigues, Jose Hilario Pereira, Laundon, Melinda

المصدر: Education + Training, 2023, Vol. 65, Issue 8/9, pp. 1070-1084.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/ET-10-2022-0407