يعرض 1 - 10 نتائج من 33,491 نتيجة بحث عن '"A. Ung"', وقت الاستعلام: 1.01s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Technical note: Improving the European air quality forecast of the Copernicus Atmosphere Monitoring Service using machine learning techniques

    المؤلفون: J.-M. Bertrand, F. Meleux, A. Ung, G. Descombes, A. Colette

    المصدر: Atmospheric Chemistry and Physics, Vol 23, Pp 5317-5333 (2023)

    مصطلحات موضوعية: Physics, QC1-999, Chemistry, QD1-999

    وصف الملف: electronic resource

    Relation: https://acp.copernicus.org/articles/23/5317/2023/acp-23-5317-2023.pdf; https://doaj.org/toc/1680-7316; https://doaj.org/toc/1680-7324

    URL الوصول: https://doaj.org/article/c5a157687a71488b8535c7dde31c207c

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  2. 2
    مؤتمر
    xMTrans: Temporal Attentive Cross-Modality Fusion Transformer for Long-Term Traffic Prediction

    المؤلفون: Ung, Huy Quang, Niu, Hao, Dao, Minh-Son, Wada, Shinya, Minamikawa, Atsunori

    المصدر: 2024 25th IEEE International Conference on Mobile Data Management (MDM) MDM Mobile Data Management (MDM), 2024 25th IEEE International Conference on. :195-202 Jun, 2024

    Relation: 2024 25th IEEE International Conference on Mobile Data Management (MDM)

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  3. 3
    مؤتمر
    Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball

    المؤلفون: Kim, You-Gwon, Kim, Heon-Su, Kim, Tae-Wan, Ryu, Seoung-Ung, Kim, Hak-Sung, Jang, Yong-Rae, Han, Bongtae, Lee, Jun-Hyeong, Kim, Jin-Kyu

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2261-2266 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Advanced Bonding Process based on Intense Pulsed Light Irradiation for Solder Bump in Flip-Chip Package

    المؤلفون: Ryu, Seong-Ung, Park, Jong-Whi, Ju, Young-Min, Kim, Hak-Sung

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2218-2222 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    دورية أكاديمية
    Historical reconstruction of background air pollution over France for 2000–2015

    المؤلفون: E. Real, F. Couvidat, A. Ung, L. Malherbe, B. Raux, A. Gressent, A. Colette

    المصدر: Earth System Science Data, Vol 14, Pp 2419-2443 (2022)

    مصطلحات موضوعية: Environmental sciences, GE1-350, Geology, QE1-996.5

    وصف الملف: electronic resource

    Relation: https://essd.copernicus.org/articles/14/2419/2022/essd-14-2419-2022.pdf; https://doaj.org/toc/1866-3508; https://doaj.org/toc/1866-3516

    URL الوصول: https://doaj.org/article/11db7dba603941e3a9c664c163f92a4f

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  6. 6
    مؤتمر
    Securing the Internet of Medical Things (IoMT) with K3S and Hybrid Cryptography: Integrating Post-Quantum Approaches for Enhanced Embedded System Security

    المؤلفون: EI-Hadedy, Mohamed, Ankunda, Patricia V., Ung, James, Hwu, Wen-Mei

    المصدر: 2024 IEEE 17th Dallas Circuits and Systems Conference (DCAS) Circuits and Systems Conference (DCAS), 2024 IEEE 17th Dallas. :1-6 Apr, 2024

    Relation: 2024 IEEE 17th Dallas Circuits and Systems Conference (DCAS)

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  7. 7
    مؤتمر
    9.6 A 6th-Order Quadrature CTDSM using Double-OTA and Quadrature NSSAR with 171.3dB FoMs in 14nm

    المؤلفون: Lee, Jongmi, Cho, Seong-Eun, Lee, Jaehoon, Lim, Yong, Oh, Seunghyun, Lee, Jongwoo, Kwak, Sung-Ung

    المصدر: 2024 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2024 IEEE International. 67:178-180 Feb, 2024

    Relation: 2024 IEEE International Solid-State Circuits Conference (ISSCC)

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  8. 8
    مؤتمر
    9.2 A 2.08mW 64.4dB SNDR 400MS/s 12b Pipelined-SAR ADC using Mismatch and PVT Variation Tolerant Dynamically Biased Ring Amplifier in 8nm

    المؤلفون: Lim, Yong, Lee, Jaehoon, Lee, Jongmi, Lim, Kwangmin, Oh, Seunghyun, Lee, Jongwoo, Kwak, Sung-Ung

    المصدر: 2024 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2024 IEEE International. 67:170-172 Feb, 2024

    Relation: 2024 IEEE International Solid-State Circuits Conference (ISSCC)

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  9. 9
    تقرير
    Changing Answer Order Can Decrease MMLU Accuracy

    المؤلفون: Gupta, Vipul, Pantoja, David, Ross, Candace, Williams, Adina, Ung, Megan

    مصطلحات موضوعية: Computer Science - Computation and Language

    URL الوصول: http://arxiv.org/abs/2406.19470

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  10. 10
    تقرير
    Improved Modularity and New Features in ipie: Towards Even Larger AFQMC Calculations on CPUs and GPUs at Zero and Finite Temperatures

    المؤلفون: Jiang, Tong, Baumgarten, Moritz K. A., Loos, Pierre-François, Mahajan, Ankit, Scemama, Anthony, Ung, Shu Fay, Zhang, Jinghong, Malone, Fionn D, Lee, Joonho

    مصطلحات موضوعية: Physics - Chemical Physics

    URL الوصول: http://arxiv.org/abs/2406.16238

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