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1مؤتمر
المؤلفون: Kaiser, J., Datta, S., Behin-Aein, B.
المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :21.4.1-21.4.4 Dec, 2022
Relation: 2022 IEEE International Electron Devices Meeting (IEDM)
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2مؤتمر
المؤلفون: Lee, T. Y., Yamane, K., Hau, L. Y., Chao, R., Chung, N. L., Naik, V. B., Sivabalan, K., Kwon, J., Lim, J. H., Neo, W. P., Khua, K., Thiyagarajah, N., Jang, S. H., Behin-Aein, B., Toh, E. H., Otani, Y., Zeng, D., Balasankaran, N., Goh, L. C., Ling, T., Hwang, J., Zhang, L., Low, R., Tan, S. L, Seet, C. S., Ting, J. W., Ong, S., You, Y. S., Woo, S. T., Quek, E., Siah, S. Y.
المصدر: 2020 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2020 IEEE International. :1-4 Apr, 2020
Relation: 2020 IEEE International Reliability Physics Symposium (IRPS)
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3دورية أكاديمية
المؤلفون: Song, J., Dixit, H., Behin-Aein, B., Kim, C.H., Taylor, W.
المصدر: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 56(12):1-11 Dec, 2020
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4مؤتمر
المؤلفون: Naik, V. B., Yamane, K., Kwon, J., K, S., Lim, J. H., Ali, Z., Behin-Aein, B., Chung, N. L., Hau, L. Y., Chao, R., Chiang, C., Huang, Y., Pu, L., Otani, Y., Dixit, H., Jang, S. H., Balasankaran, N., Tan, F., Neo, W. P., Goh, L. C., Toh, E. H., Ling, T., Ting, J. W., Yoon, H., Congedo, G., Mueller, J., Pfefferling, B., Kallensee, O., Vogel, A., Merbeth, T., Seet, C. S., Wong, J., Bordelon, J., You, Y. S., Soss, S., Chan, T. H., Quek, E., Siah, S. Y.
المصدر: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021
Relation: 2021 Symposium on VLSI Technology
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5مؤتمر
المؤلفون: Naik, V.B., Yamane, K., Lim, J.H., Lee, T.Y., Kwon, J., Aein, B., Chung, N.L., Hau, L.Y., Chao, R., Zeng, D., Otani, Y., Chiang, C., Huang, Y., Pu, L., Thiyagarajah, N., Jang, S.H., Neo, W.P., Dixit, H., Aris, S.K., Goh, L.C., Ling, T., Hwang, J., Ting, J.W., Zhang, L., Low, R., Balasankaran, N., Seet, C.S., Ong, S., Wong, J., You, Y.S., Woo, S.T., Siah, S.Y.
المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020
Relation: 2020 IEEE Symposium on VLSI Technology
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6مؤتمر
المؤلفون: Naik, V. B., Yamane, K., Lee, T.Y., Kwon, J., Chao, R., Lim, J.H., Chung, N.L., Behin-Aein, B., Hau, L.Y., Zeng, D., Otani, Y., Chiang, C., Huang, Y., Pu, L., Jang, S.H., Neo, W.P., Dixit, H., Goh, S. K L. C., Toh, E. H., Ling, T., Hwang, J., Ting, J.W., Low, R., Zhang, L., Lee, C.G., Balasankaran, N., Tan, F., Gan, K. W., Yoon, H., Congedo, G., Mueller, J., Pfefferling, B., Kallensee, O., Vogel, A., Kriegerstein, V., Merbeth, T., Seet, C.S., Ong, S., Xu, J., Wong, J., You, Y.S., Woo, S.T., Chan, T.H., Quek, E., Siah, S. Y.
المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :11.3.1-11.3.4 Dec, 2020
Relation: 2020 IEEE International Electron Devices Meeting (IEDM)
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7مؤتمر
المؤلفون: Naik, V. B., Lee, K., Yamane, K., Chao, R., Kwon, J., Thiyagarajah, N., Chung, N. L., Jang, S. H., Behin-Aein, B., Lim, J. H., Lee, T. Y., Neo, W. P., Dixit, H., K, S., Goh, L. C., Ling, T., Hwang, J., Zeng, D., Ting, J. W., Toh, E. H., Zhang, L., Low, R., Balasankaran, N., Zhang, L. Y., Gan, K. W., Hau, L. Y., Mueller, J., Pfefferling, B., Kallensee, O., Tan, S. L., Seet, C. S., You, Y. S., Woo, S. T., Quek, E., Siah, S. Y., Pellerin, J.
المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :2.3.1-2.3.4 Dec, 2019
Relation: 2019 IEEE International Electron Devices Meeting (IEDM)
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8مؤتمر
المؤلفون: Lee, K., Yamane, K., Noh, S., Naik, V. B., Yang, H., Jang, S. H., Kwon, J., Behin-Aein, B., Chao, R., Lim, J. H., S. K., Gan, K. W., Zeng, D., Thiyagarajah, N., Goh, L. C., Liu, B., Toh, E. H., Jung, B., Wee, T. L., Ling, T., Chan, T. H., Chung, N. L., Ting, J. W., Lakshmipathi, S., Son, J. S., Hwang, J., Zhang, L., Low, R., Krishnan, R., Kitamura, T., You, Y. S., Seet, C. S., Cong, H., Shum, D., Wong, J., Woo, S. T., Lam, J., Quek, E., See, A., Siah, S. Y.
المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :183-184 Jun, 2018
Relation: 2018 IEEE Symposium on VLSI Technology
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9مؤتمر
المؤلفون: Lee, K., Chao, R., Yamane, K., Naik, V. B., Yang, H., Kwon, J., Chung, N. L., Jang, S. H., Behin-Aein, B., Lim, J.H., K, S., Liu, B., Toh, E. H., Gan, K. W., Zeng, D., Thiyagarajah, N., Goh, L. C., Ling, T., Ting, J. W., Hwang, J., Zhang, L., Low, R., Krishnan, R., Tan, S. L, You, Y. S., Seet, C. S., Cong, H., Wong, J., Woo, S. T., Quek, E., Siah, S. Y.
المصدر: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :27.1.1-27.1.4 Dec, 2018
Relation: 2018 IEEE International Electron Devices Meeting (IEDM)
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10دورية أكاديمية
المؤلفون: Xie, Y., Behin-Aein, B., Ghosh, A.W.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 64(1):319-324 Jan, 2017