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    كتاب إلكتروني

    المساهمون: Goos, Gerhard, Series EditorAff1, Hartmanis, Juris, Founding EditorAff2, Bertino, Elisa, Editorial Board MemberAff3, Gao, Wen, Editorial Board MemberAff4, Steffen, Bernhard, Editorial Board MemberAff5, Yung, Moti, Editorial Board MemberAff6, Tekinerdoğan, Bedir, editorAff7, Spalazzese, Romina, editorAff8, Sözer, Hasan, editorAff9, Bonfanti, Silvia, editorAff10, Weyns, Danny, editorAff11

    المصدر: Software Architecture. ECSA 2023 Tracks, Workshops, and Doctoral Symposium : Istanbul, Turkey, September 18–22, 2023, Revised Selected Papers. 14590:257-271

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    دورية أكاديمية
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    مؤتمر

    المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-5 Jul, 2020

    Relation: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)