يعرض 1 - 10 نتائج من 2,338 نتيجة بحث عن '"Fan Out"', وقت الاستعلام: 0.99s تنقيح النتائج
  1. 1
    مؤتمر
    Introduction of Digital System-in-Package Building Block for Space Applications

    المؤلفون: Garcia, Hugo, Jochem, Helene, Venet, Norbert, Rocci, Mirko, Dabas, Andres Matias, Sollecchia, Luca, Juul, Poul, Ankeraa, Kim, Mayr, Monique, Scalmati, Paolo, Cucinella, Giovanni

    المصدر: 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2024 IMAPS Nordic Conference on. :1-6 Jun, 2024

    Relation: 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

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  2. 2
    مؤتمر
    Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications

    المؤلفون: Liu, Yu-Chen, Lwo, Ben-Je, Chung, Tai-Chiang

    المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-4 Jun, 2024

    Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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  3. 3
    مؤتمر
    Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications

    المؤلفون: Sung, Ki-Jun, Eun, Kyoungtae, Kim, Jae-Min, Jang, Se-Hyun, Lee, Seowon, Yoon, Sungwon, Kim, Jongkwan, Kim, Minsuk, Yun, Jiyeong, Ju, Jeongho, Son, Ho-Young, Lee, Kang-Wook

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :34-39 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Focal Extension – A Novel Lithography Technique in Direct-Write Laser Lithography to Enable Fine-Pitch Patterning over Large Topography

    المؤلفون: Sabbir, Golam, Iyer, Subramanian S.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2125-2130 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Challenges and Innovations in Dual Damascene Polymer RDL with 2 μm Pitch and Beyond

    المؤلفون: Briggs, Benjamin D., Ley, Ryan, Bencher, Chris, Quon, Roger, Chuang, C C, Suo, Peng, Bum Yong, Andy Chang, Bozano, Luisa, Fernandez, Jorge, Lianto, Prayudi, Khasgiwale, Niranjan, Krishnan, Siddarth

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :571-575 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Multi-wideband Antenna in Package with Dual Polarizations

    المؤلفون: Sun, Mei

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1712-1715 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging

    المؤلفون: Braun, Tanja, Holck, Ole, Adler, Marius, Obst, Mattis, Voges, Steve, Becker, Karl-Friedrich, Aschenbrenner, Rolf, Voitel, Marcus, Dreissigacker, Marc, Schneider-Ramelow, Martin

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1-6 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Advanced Thermocompression Bonding on High Density Fan-Out Embedded Bridge Technology for HPC/AI/ML Applications

    المؤلفون: Wudjud, Wiwy, Lin, ShuYu, Chang, Yungshun, Yen, Jean, Liao, Reno, Cheng, LeoHS, Wu, Yihsien, Huang, Simon YL, Chen, Jui Tzu, Lee, ChengYu, Huang, JoeyCl, Cao, Lihong

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :929-935 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Void Migration Kinetics in Fine Line Cu RDL under Electric Current Stressing and the Improvement of Electromigration Reliability by Polyimide Passivation

    المؤلفون: Huang, Yen-Cheng, Tsai, Min-Yan, Lin, Ting-Chun, Lin, Yung-Sheng, Wang, Chen-Chao, Hung, Chih-Pin, Lin, Kwang-Lung

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :576-580 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Overlay Challenges of Extremely Large Exposure Field, Fine Resolution Lithography Due to Alignment Solution Errors and a Solution Using Early Zone Corrections in Advanced IC Substrates

    المؤلفون: Chang, John, Song, Xing, Chang, Timothy, Best, Keith

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2070-2074 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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