المؤلفون: Guan, Lim Teck, Ching, Eva Wai Leong, Yi, Lim Wei, Cheng, Ta-Chien, Lee, Kangho, Janesky, Jason, Gow, Earl

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :349-354 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Gogl, Dietmar, Arndt, Christian, Barwin, John C., Bette, Alexander, DeBrosse, John, Gow, Earl, Hoenigschmid, Heinz, Lammers, Stefan, Lamorey, Mark, Yu Lu, Maffitt, Tom, Maloney, Kim, Obermaier, Werner, Sturm, Andre, Viehmann, Hans, Willmott, Dennis, Wood, Mark, Gallagher, William J., Mueller, Gerhard, Sitaram, Arkalgud R.

المصدر: IEEE Journal of Solid-State Circuits; Apr2005, Vol. 40 Issue 4, p902-908, 7p, 15 Color Photographs, 6 Diagrams, 1 Chart, 5 Graphs

مصطلحات موضوعية: RANDOM access memory, COMPUTER storage devices, ELECTRONIC circuit design, COMPLEMENTARY metal oxide semiconductors, INTEGRATED circuits