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1دورية أكاديمية
المؤلفون: Hong Son Nguyen, Tran Trung Hieu, Nguyen Manh Thang, Huynh Nhu Tan, Nguyen Tien Can, Pham Thi Thao, Nguyen Chi Bao
المصدر: Engineering, Technology & Applied Science Research, Vol 14, Iss 4 (2024)
مصطلحات موضوعية: MCDM, PIV, weight method, crankshaft material, Engineering (General). Civil engineering (General), TA1-2040, Technology (General), T1-995, Information technology, T58.5-58.64
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Hong Son Nguyen, Myounggon Kim, Changbin Im, Sanghoon Han, JungHyun Han
المصدر: IEEE Access, Vol 11, Pp 117393-117402 (2023)
مصطلحات موضوعية: Augmented reality, 3D human pose estimation, pose correction, pose matching, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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3دورية أكاديمية
المصدر: Nano Express, Vol 5, Iss 2, p 025026 (2024)
مصطلحات موضوعية: BNPs, Fe/Cu, Fe/Ni, methylene blue, Camellia sinenis, Chemical technology, TP1-1185
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2632-959X
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4دورية أكاديمية
المؤلفون: Thi Ngoc Thu Tran, Kuan Shiong Khoo, Kit Wayne Chew, Tra Qui Phan, Hong Son Nguyen, Toan Nguyen-Sy, Thi Dong Phuong Nguyen, Wei-Hsin Chen, Pau Loke Show
المصدر: Materials Science for Energy Technologies, Vol 3, Iss , Pp 840-845 (2020)
مصطلحات موضوعية: Drying kinetic, Dried mushroom, Dehydration, Pleurotus mushroom, Drying conditions, Materials of engineering and construction. Mechanics of materials, TA401-492, Energy conservation, TJ163.26-163.5
وصف الملف: electronic resource
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5مؤتمر
المؤلفون: Hong Son, Nguyen, Thai-Nghe, Nguyen
المصدر: 2019 International Conference on Advanced Computing and Applications (ACOMP) Advanced Computing and Applications (ACOMP), 2019 International Conference on. :92-96 Nov, 2019
Relation: 2019 International Conference on Advanced Computing and Applications (ACOMP)
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6تقرير
المؤلفون: Hong, Son Nguyen, Anh, Hao Nguyen, Trong, Thua Huynh
المصدر: International Journal of Computer Networks & Communications (IJCNC) Vol.6, No.5, September 2014 pp. 183-192
مصطلحات موضوعية: Computer Science - Networking and Internet Architecture, 68M10
URL الوصول: http://arxiv.org/abs/1410.3073
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7
المصدر: Journal of Advanced Research in Fluid Mechanics and Thermal Sciences. 104:21-36
مصطلحات موضوعية: Fluid Flow and Transfer Processes
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5d41d750fa2e43be079d67b8dbe4d422
https://doi.org/10.37934/arfmts.104.1.2136 -
8دورية أكاديمية
المؤلفون: Quan-Hoang Vuong, Tam-Tri Le, Ruining Jin, Quy Van Khuc, Hong-Son Nguyen, Thu-Trang Vuong, Minh-Hoang Nguyen
المصدر: MDPI, IJERPH. 20(6):1-17
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9
المؤلفون: Hong Son Nguyen, Tien Anh Nguyen, Thi Lan Anh Luu, Thang Phan Nguyen, Tuan Canh Nguyen, Ngoc Phuong Thao Nguyen, Thi Bich Nguyen, Thi Thuy Huong Nguyen, Huu Lam Nguyen, Il Tae Kim, Cong Tu Nguyen
المصدر: Ceramics International. 48:18687-18698
مصطلحات موضوعية: Process Chemistry and Technology, Materials Chemistry, Ceramics and Composites, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials
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10
المؤلفون: Hong Son Nguyen, Nhu Uyen Thi Vo
المصدر: Applied Engineering Letters : Journal of Engineering and Applied Sciences. 7:143-153
مصطلحات موضوعية: General Energy, General Engineering, General Materials Science
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5a82f0e0bd05f68abfe07a038438eb0e
https://doi.org/10.18485/aeletters.2022.7.4.2