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المؤلفون: Chao-Wei Liu, Ming-Hung Chen, Tun-Ching Pi, Jen-Chieh Kao, Yung-I Yeh
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d218d8128ab8070a6f354236fb075dd7
https://doi.org/10.1109/ectc51906.2022.00161 -
2
المؤلفون: Wei-Tung Chang, Shihwen Lu, Harrison Chang, Huei-Shyong Cho, Jen Chieh Kao, Hsu Shao-En, Ye Yeh
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Manufacturing process, ComputerSystemsOrganization_COMPUTER-COMMUNICATIONNETWORKS, Data_CODINGANDINFORMATIONTHEORY, Substrate (printing), Characterization (materials science), Reliability (semiconductor), ComputerApplications_MISCELLANEOUS, visual_art, Electronic component, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, visual_art.visual_art_medium, Radio frequency, Antenna (radio), 5G
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1708a432878c78c7d48e163861e29ea3
https://doi.org/10.1109/ectc32696.2021.00271 -
3
المؤلفون: Jen-Chieh Kao, Chao-Wei Liu, Chang-Lin Yeh, Shang-Lin Wu, Tun-Ching Pi, Ming-Hung Chen
المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
مصطلحات موضوعية: System in package, Materials science, visual_art, Ball size, Electronic component, Miniaturization, Ball (bearing), visual_art.visual_art_medium, Geometry, Lower cost, Solder ball, Grinding
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::43909b3ff0bee62d891b4171b9bd43b6
https://doi.org/10.1109/eurosime48426.2020.9152667 -
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المؤلفون: Jen-Chieh Kao, Hung-Ju Wei, Chinchun Meng, Guo-Wei Huang
المصدر: 2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF).
مصطلحات موضوعية: Engineering, Digital down converter, business.industry, 020208 electrical & electronic engineering, Electrical engineering, Schottky diode, 020206 networking & telecommunications, 02 engineering and technology, BiCMOS, Silicon-germanium, chemistry.chemical_compound, chemistry, Balun, 0202 electrical engineering, electronic engineering, information engineering, Radio frequency, Wideband, business, Frequency mixer
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::232d0c4236b5b78d8e10b868c72b6427
https://doi.org/10.1109/sirf.2016.7445466 -
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المؤلفون: Tai-Lin Lo, Chinchun Meng, Jen-Chieh Kao, Guo-Wei Huang
المصدر: 2015 Asia-Pacific Microwave Conference (APMC).
مصطلحات موضوعية: Materials science, Digital down converter, business.industry, Balun, Impedance matching, Electrical engineering, Buffer amplifier, Schottky diode, business, Frequency mixer, Cutoff frequency, V band
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::34cf1bc7b0f0b5d9691365c0e79b611e
https://doi.org/10.1109/apmc.2015.7411813 -
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المؤلفون: Yung-Yi Yeh, Jen-Chieh Kao, Chang-Lin Yeh, Chang-Chi Lee, Ho-Ming Tong, Tong Hong Wang
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference.
مصطلحات موضوعية: Materials science, business.product_category, business.industry, Three-dimensional integrated circuit, Coplanarity, Structural engineering, Flattening, Flexural strength, Spring (device), Soldering, Die (manufacturing), Deformation (engineering), Composite material, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c5aa62c60a39ac94faa1aef90e9753cb
https://doi.org/10.1109/ectc.2013.6575680