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1دورية أكاديمية
المؤلفون: Hsiang-Hou Tseng, Man-Chi Lan, Wei-You Hsu, Jia-Juen Ong, Dinh-Phuc Tran, Chih Chen
المصدر: Journal of Materials Research and Technology, Vol 27, Iss , Pp 7957-7963 (2023)
مصطلحات موضوعية: Nanotwinned copper, Epitaxial silver film, Metal direct bonding, Electroless-deposition, Diffusion bonding, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Jia-Juen Ong, Dinh-Phuc Tran, Man-Chi Lan, Kai-Cheng Shie, Po-Ning Hsu, Nien‑Ti Tsou, Chih Chen
المصدر: Scientific Reports, Vol 12, Iss 1, Pp 1-10 (2022)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2045-2322
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3دورية أكاديمية
المؤلفون: Yu-Hao Kuo, Dinh-Phuc Tran, Jia-Juen Ong, K.N. Tu, Chih Chen
المصدر: Journal of Materials Research and Technology, Vol 18, Iss , Pp 859-871 (2022)
مصطلحات موضوعية: Nanotwinned Cu, Hybrid bonding, Fracture modes, Grain growth, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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4دورية أكاديمية
المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen
المصدر: Materials, Vol 15, Iss 5, p 1888 (2022)
مصطلحات موضوعية: Cu/SiO2 hybrid bonding, highly (111)-nanotwinned Cu, low temperature bonding, microelectronic packaging, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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5دورية أكاديمية
المؤلفون: Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen
المصدر: Metals, Vol 11, Iss 11, p 1864 (2021)
مصطلحات موضوعية: highly -oriented nanotwinned copper, die-to-die bonding, die-to-wafer bonding, post-annealing, grain growth, die shear test, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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6
المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Hsiang-Hung Chang, Dinh-Phuc Tran, Chih Chen
المصدر: 2023 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ec7994d2fe1fc1866f28a7b3850121cd
https://doi.org/10.23919/icep58572.2023.10129702 -
7
المؤلفون: Shih-Chi Yang, Jia-Juen Ong., Dinh-Phuc Tran, Wei-Lan Chiu, Ou-Hsing Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Chih Chen
المصدر: 2023 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::006b89dc32a9b277cf53d110fb93b01b
https://doi.org/10.23919/icep58572.2023.10129678 -
8
المؤلفون: Jia-Juen Ong, Dinh-Phuc Tran, Yu-Min Hsun, Wei-Lan Chiu, Ou-Hsiang Lee, Hsiang-Hung Chang, Chih Chen
المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a66139431605596f89d2c074ca6307ca
https://doi.org/10.1109/impact56280.2022.9966728 -
9
المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Hsiang-Hung Chang, Chih Chen
المصدر: 2022 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ba502f7dc16ba5608c810f6d3fa5dbe3
https://doi.org/10.23919/icep55381.2022.9795579 -
10
المؤلفون: Jia-Juen Ong, Dinh-Phuc Tran, You-Yi Lin, Po-Ning Hsu, Chih Chen
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5d919eb88a69cc4efefe61a7fc6bfc0c
https://doi.org/10.1109/ectc51906.2022.00193