المؤلفون: Sell, B., An, S., Armstrong, J., Bahr, D., Bains, B., Bambery, R., Bang, K., Basu, D., Bendapudi, S., Bergstrom, D., Bhandavat, R., Bhowmick, S., Buehler, M., Caselli, D., Cekli, S., Chaganti, Vrsk., Chang, Y. J., Chikkadi, K., Chu, T., Crimmins, T., Darby, G., Ege, C., Elfick, P., Elko-Hansen, T., Fang, S., Gaddam, C., Ghoneim, M., Gomez, H., Govindaraju, S., Guo, Z., Hafez, W., Haran, M., Hattendorf, M., Hu, S., Jain, A., Jaloviar, S., Jang, M., Kameswaran, J., Kapinus, V., Kennedy, A., Klopcic, S., Krishnan, D., Leib, J., Lin, Y.-T., Lindert, N., Liu, G., Loh, O., Luo, Y., Mani, S., Mleczko, M., Mocherla, S., Packan, P., Paik, M., Paliwal, A., Pandey, R., Patankar, K., Pipes, L., Plekhanov, P., Prasad, C., Prince, M., Ramalingam, G., Ramaswamy, R., Riley, J., Perez, J. R. Sanchez, Sandford, J., Sathe, A., Shah, F., Shim, H., Subramanian, S., Tandon, S., Tanniru, M., Thakurta, D., Troeger, T., Wang, X., Ward, C., Welsh, A., Wickramaratne, S., Wnuk, J., Xu, S. Q., Yashar, P., Yaung, J., Yoon, K., Young, N.

المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :282-283 Jun, 2022

Relation: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

المؤلفون: Zhao, D., Letz, S., Leib, J., Schletz, A.

المصدر: In Microelectronics Reliability November 2023 150

المؤلفون: Curran, B., Reyes, J., Tschoban, C., Hofer, J., Grams, A., Wust, F., Hutter, M., Leib, J., Martinez-Vazquez, M., Baggen, R., Ndip, I., Lang, K.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 8(7):1231-1240 Jul, 2018

المؤلفون: Hansen, U., Maus, S., Leib, J., Toepper, M.

المصدر: 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP) Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on. :237-241 May, 2010

Relation: 2010 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Maus, S., Hansen, U., Leib, J., Toepper, M.

المصدر: 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP) Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on. :242-246 May, 2010

Relation: 2010 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Auth, C., Aliyarukunju, A., Asoro, M., Bergstrom, D., Bhagwat, V., Birdsall, J., Bisnik, N., Buehler, M., Chikarmane, V., Ding, G., Fu, Q., Gomez, H., Han, W., Hanken, D., Haran, M., Hattendorf, M., Heussner, R., Hiramatsu, H., Ho, B., Jaloviar, S., Jin, I., Joshi, S., Kirby, S., Kosaraju, S., Kothari, H., Leatherman, G., Lee, K., Leib, J., Madhavan, A., Marla, K., Meyer, H., Mule, T., Parker, C., Parthasarathy, S., Pelto, C., Pipes, L., Post, I., Prince, M., Rahman, A., Rajamani, S., Saha, A., Santos, J. Dacuna, Sharma, M., Sharma, V., Shin, J., Sinha, P., Smith, P., Sprinkle, M., Amour, A. St., Staus, C., Suri, R., Towner, D., Tripathi, A., Tura, A., Ward, C., Yeoh, A.

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :29.1.1-29.1.4 Dec, 2017

Relation: 2017 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Leib, J., Mund, D., Topper, M.

المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :562-565 2005

Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference

المؤلفون: Dalal, V.L., Leib, J., Muthukrishnan, K., Stieler, D., Noack, M.

المصدر: Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, 2005. Photovoltaic Specialists Conference Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE. :1448-1451 2005

Relation: Conference Record of the Thirty-First IEEE Photovoltaic Specialists Conference

المؤلفون: Leib, J., Bieck, F., Hansen, U., Looi, K.-K., Ngo, H.-D., Seidemann, V., Shariff, D., Studzinski, D., Suthiwongsunthorn, N., Tan, K., Wilke, R., Yam, K.-L., Topper, M.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 33(3):713-721 Aug, 2010

المؤلفون: Lo, C.C.H., Snyder, J.E., Leib, J., Wang, D., Qian, Z., Daughton, J.M., Jiles, D.C.

المصدر: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 37(4):2337-2339 Jul, 2001