المؤلفون: Hadi Askarifirouzjaei, Leila Khajoueinejad, Elena Wei, Sruti Cheruvu, Carlos Ayala, Ning Chiang, Thomas Theis, Dongming Sun, Mehdi Fazeli, Wise Young

المصدر: Pathophysiology, Vol 30, Iss 3, Pp 275-295 (2023)

مصطلحات موضوعية: bladder, spinal cord injury, hemorrhagic cystitis, gender, neutrophil, Physiology, QP1-981

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1873-149X/30/3/23; https://doaj.org/toc/1873-149X

URL الوصول: https://doaj.org/article/898c77149ec94e42afb51f034c2d6f6a

المؤلفون: Zikuan Leng, Dongming Sun, Zihao Huang, Iman Tadmori, Ning Chiang, Nikhit Kethidi, Ahmed Sabra, Yoshihiro Kushida, Yu-Show Fu, Mari Dezawa, Xijing He, Wise Young

المصدر: Cell Transplantation, Vol 28 (2019)

مصطلحات موضوعية: Medicine

وصف الملف: electronic resource

Relation: https://doaj.org/toc/0963-6897; https://doaj.org/toc/1555-3892

URL الوصول: https://doaj.org/article/d0f5143e014143719118f654ffe02824

المؤلفون: Ning Chiang, Yu-Tien Hsiao, Hui-Ju Yang, Yu-Chun Lin, Juu-Chin Lu, Chih-Tien Wang

المصدر: PLoS ONE, Vol 9, Iss 6, p e99180 (2014)

مصطلحات موضوعية: Medicine, Science

وصف الملف: electronic resource

Relation: http://europepmc.org/articles/PMC4067274?pdf=render; https://doaj.org/toc/1932-6203

URL الوصول: https://doaj.org/article/15c5b0c65d584f5ebc3658668ec208c6

المؤلفون: Li-Ling Liao, Chun-Kai Liu, Kuo-Ning Chiang

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :372-377 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Chia-Cheng Chang, Hung-Te Yang, Yen-Fu Su, Yu-Ting Hong, Kuo-Ning Chiang

المصدر: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on. :536-538 May, 2016

Relation: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Hung, Tuan-Yu, Chin-Chun Wang, Kuo-Ning Chiang

المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-6 Apr, 2013

Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Alfred Fillol-Salom, Rodrigo Bacigalupe, Suzanne Humphrey, Yin Ning Chiang, John Chen, José R. Penadés

المصدر: Nature Communications, Vol 12, Iss 1, Pp 1-12 (2021)

مصطلحات موضوعية: Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2041-1723

URL الوصول: https://doaj.org/article/6959862482bf4a9bbc899bd86e3da205

المؤلفون: Yen-Ju Lee, Yen-Fu Su, Tuan-Yu Hung, Kuo-Ning Chiang

المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :299-302 Oct, 2012

Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Chien-Fu Huang, Yen-Fu Su, Shin-Yueh Yang, Chia-Liang Hsu, Nai-Chuan Chen, Kuo-Ning Chiang

المصدر: 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on. :303-307 May, 2012

Relation: 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Chang-Chun Lee, Chien-Chia Chiu, Kuo-Ning Chiang, Tai-Chun Huang, Chih-Hsiang Yao, Chin-Chiu Hsia, Mong-Song Liang

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :885-891 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems