يعرض 1 - 9 نتائج من 9 نتيجة بحث عن '"O'Toole, Eoin"', وقت الاستعلام: 0.98s تنقيح النتائج
  1. 1
    مؤتمر
    A Hybrid Panel Level Package (Hybrid PLP) Technology Based on a 650-mm x 650-mm Platform

    المؤلفون: O'Toole, Eoin, Silva, Jose Luis, Cardoso, Filipe, Silva, Jose, Alves, Luis, Souto, Marcio, Delduque, Nuno, Coelho, Anibal, Silva, Jose Miguel, Do, WonChul, Khim, JinYoung

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :824-827 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    eWLB and the challenge of metal burr at die edges

    المؤلفون: O'Toole, Eoin, Campos, Jose, Kroehnert, Steffen

    المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-4 Dec, 2015

    Relation: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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  3. 3
    مؤتمر
    Development of Fan-In WLP with mechanical protection and dynamic warpage characterization of eWLB

    المؤلفون: Campos, Jose, O'Toole, Eoin, Pinto, Raquel, Cardoso, Andre, Toussaint, Pierre-Louis, Vernhes, Pierre

    المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1689-1694 May, 2015

    Relation: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Package thickness - how low can you go with WLFO

    المؤلفون: O'Toole, Eoin, Campos, Jose, Kroehnert, Steffen, Barbosa, Virgilio, Dias, Leonor

    المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-3 Sep, 2016

    Relation: 2016 6th Electronic System-Integration Technology Conference (ESTC)

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  5. 5
    مؤتمر
    Enabling of Fan-Out WLP for more demanding applications by introduction of enhanced dielectric material for higher reliability

    المؤلفون: Almeida, Rodrigo, Barros, Isabel, Campos, Jose, Cardoso, Paulo, Castro, Jose, Henriques, Vitor, O'Toole, Eoin, Pinho, Nelson

    المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :935-939 May, 2014

    Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Wafer warpage in FO-WLP — Making friends out of enemies

    المؤلفون: O'Toole, Eoin, Ribeiro, Mario, Campos, Jose

    المصدر: 2013 Eurpoean Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC) , 2013 European. :1-4 Sep, 2013

    Relation: 2013 European Microelectronics Packaging Conference (EMPC)

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  7. 7
    مؤتمر
    Fan-out WLP — The enabler for system-in-package on Wafer Level (WLSIP)

    المؤلفون: Krohnert, Steffen, Campos, Jose, O'Toole, Eoin

    المصدر: 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-8 Sep, 2012

    Relation: 2012 4th Electronic System-Integration Technology Conference (ESTC)

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  8. 8
    دورية أكاديمية
    A PRACTICAL GUIDE TO FORELIMB AMPUTATION.

    المؤلفون: O'Toole, Eoin, Cuddy, Laura

    المصدر: Veterinary Ireland Journal; Aug2024, Vol. 14 Issue 8, p448-450, 3p

    مصطلحات موضوعية: SURGICAL blood loss, PREOPERATIVE risk factors, LATISSIMUS dorsi (Muscles), SURGICAL site, LYMPHADENECTOMY, FASCIAE (Anatomy)

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  9. 9
    دورية
    WLFO Packaging Technology-based WLSiP - Enabler for Packaging of IoT/IoE Modules.

    المؤلفون: Kroehnert, Steffen, Campos, José, Cardoso, André, O'Toole, Eoin, Janeiro, Abel

    المصدر: Advancing Microelectronics; May/Jun2017, Vol. 44 Issue 3, p6-10, 5p

    مصطلحات موضوعية: ELECTRONIC packaging, SYSTEM integration, SYSTEMS engineering

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