المؤلفون: Gupta, G., Kanamura, M., Swenson, B., Bisi, D., Romanczyk, B., Neufeld, C., Wienecke, S., Ogino, T., Miyazaki, Y., Imanishi, K., Ikeda, J., Kamiyama, M., Guerrero, J., Labrecque, M., Prejdova, R., Cruse, B., McKay, J., Bolante, G., Wang, Z., Hosoda, T., Wu, Y., Parikh, P., Lal, R., Mishra, U.

المصدر: 2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2022 IEEE 34th International Symposium on. :349-352 May, 2022

Relation: 2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

المؤلفون: Prejdova, R.

المصدر: Diffusion and Defect Data Part B: Solid State Phenomena; January 1989, Vol. 6 Issue: 1 p585-590, 6p