يعرض 1 - 10 نتائج من 1,890 نتيجة بحث عن '"Seung Man An"', وقت الاستعلام: 0.91s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Study on Morphometrical Urban Aerodynamic Roughness Multi-Scale Exploration Using LiDAR Remote Sensing

    المؤلفون: Seung Man An, Byungsoo Kim, Chaeyeon Yi, Jeong-Hee Eum, Jung-Hun Woo, Wolfgang Wende

    المصدر: Remote Sensing, Vol 16, Iss 13, p 2418 (2024)

    مصطلحات موضوعية: building placement, aerodynamic roughness length (z0), urban canopy parameters (UCPs), morphometric method, observational method, multi-scale exploration, Science

    وصف الملف: electronic resource

    Relation: https://www.mdpi.com/2072-4292/16/13/2418; https://doaj.org/toc/2072-4292

    URL الوصول: https://doaj.org/article/d699a91ac7e5486086ff58fae2d024ae

    Find this article in full text from ProQuest Full Text Finder
    أضف إلى المفضلة
  2. 2
    دورية أكاديمية
    A Study on Urban-Scale Building, Tree Canopy Footprint Identification and Sky View Factor Analysis with Airborne LiDAR Remote Sensing Data

    المؤلفون: Seung Man An

    المصدر: Remote Sensing, Vol 15, Iss 15, p 3910 (2023)

    مصطلحات موضوعية: LiDAR, building, tree canopy, urban settings, footprint identification, sky view factor, Science

    وصف الملف: electronic resource

    Relation: https://www.mdpi.com/2072-4292/15/15/3910; https://doaj.org/toc/2072-4292

    URL الوصول: https://doaj.org/article/3a9d6eea80b84aaf88caa598b41c1c07

    Find this article in full text from ProQuest Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    Hybrid Solder with silver hierarchical structure and particle for Synergistic effect in shear strength of die attach behaviour

    المؤلفون: Jeong, Hakyung, Lee, Jae Hak, Kim, Seung Man, Park, Ah-Young, Song, Jun-Yeob

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :509-512 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  4. 4
    دورية أكاديمية
    Development and verification of new reference plasmid (pUC_GM-SB) for the DNA-based detection of genetically modified sugar beet H7-1

    المؤلفون: Suh, Seung-Man, Kim, Sumin, Kim, Hyun-Jae, Shin, Min-Ki, Kim, Hae-YeongAff1, IDs10068024015726_cor5

    المصدر: Food Science and Biotechnology. :1-7

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  5. 5
    دورية أكاديمية
    Crosslinking characteristics of aziridine crosslinkers in polyurethane-based clearcoats for automotive applications

    المؤلفون: Oh, DaegeunAff1, Aff2, Park, Junyoung, Song, Young Kyu, Noh, Seung ManAff3, IDs11998024009325_cor4, Jung, Hyun WookAff1, IDs11998024009325_cor5

    المصدر: Journal of Coatings Technology and Research. :1-14

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  6. 6
    دورية أكاديمية
    A study of the possibility of fat quantification diagnosis technology in ultrasound image using machine learning

    المؤلفون: Yu, Seung-ManAff1, IDs40042023010044_cor1

    المصدر: Journal of the Korean Physical Society. 84(5):394-401

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  7. 7
    دورية أكاديمية
    Multiplex PCR detection method of genetically modified canola event (MON94100, LBFLFK, and NS-B50027-4) combined with capillary electrophoresis

    المؤلفون: Suh, Seung-Man, Kim, Hyun-Jae, Shin, Min-Ki, Hong, Seung-Jin, Cha, Jae-Eun, Kim, Hae-YeongAff1, IDs1006802301377z_cor6

    المصدر: Food Science and Biotechnology. 33(3):637-643

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  8. 8
    مؤتمر
    Evaluation of Crack Propagation at the Interconnection Interface Induced by Warpage of Fan-Out Wafer-Level-Package

    المؤلفون: Park, Ah-Young, Lee, Jae Hak, Song, Jun-Yeob, Kim, Seung Man, Han, Seongheum

    المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :99-102 Dec, 2019

    Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  9. 9
    مؤتمر
    Study on the Embedded Flexible Hybrid Stack Package using Polymer Elastic Bump Interconnection Method

    المؤلفون: Lee, Jae Hak, Kim, Yong Jin, Kim, Seung Man, Song, Jun-Yeob

    المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-5 Sep, 2019

    Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

    أضف إلى المفضلة
  10. 10
    دورية أكاديمية
    Comparative analysis of LC-MS/MS and real-time PCR assays for efficient detection of potential allergenic silkworm

    المؤلفون: Suh, Seung-Man, Kim, Kyungdo, Yang, Seung-Min, Lee, Hana, Jun, Minkyung, Byun, Jisun, Lee, Hyeongjoo, Kim, Daseul, Lee, Dain, Cha, Jae-Eun, Kim, Jun-Su, Kim, Eiseul, Park, Zee-Yong, Kim, Hae-Yeong

    المصدر: In Food Chemistry 1 July 2024 445

    View record from ScienceDirect Full Text Finder
    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء