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1مؤتمر
المؤلفون: Lianhua Fan, Songhua Shi, Wong, C.P.
المصدر: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :303-310 2000
Relation: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces
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2مؤتمر
المؤلفون: Carr, W.W., Sarma, D.S., Lejun Wang, Songhua Shi, Cook, F.L., Pfromm, P.H.
المصدر: IAS '96. Conference Record of the 1996 IEEE Industry Applications Conference Thirty-First IAS Annual Meeting Industry applications Industry Applications Conference, 1996. Thirty-First IAS Annual Meeting, IAS '96., Conference Record of the 1996 IEEE. 4:1963-1973 vol.4 1996
Relation: IAS '96. Conference Record of the 1996 IEEE Industry Applications Conference Thirty-First IAS Annual Meeting
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3دورية أكاديمية
المؤلفون: Songhua Shi, Daoqiang Lu, Wong, C.P.
المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 22(4):268-273 Oct, 1999
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4دورية أكاديمية
المؤلفون: Songhua Shi, Yamashita, T., Wong, C.P.
المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 22(4):274-281 Oct, 1999
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5دورية أكاديمية
المؤلفون: Songhua Shi, Wong, C.P.
المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 22(4):331-339 Oct, 1999
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6
المؤلفون: Pengcheng Wang, Mingyu Zhou, Yue Zhao, Songhua Shi
المصدر: SAE Technical Paper Series.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d84b9e87d6f0e30a676893d6523a6f82
https://doi.org/10.4271/2022-01-7101 -
7
المؤلفون: Songhua Shi, Peter Tortorici, Sai Vadlamani, Prithwish Chatterjee
المصدر: 3D Microelectronic Packaging ISBN: 9789811570896
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d2593b100dadc424eec5142544ce9e8d
https://doi.org/10.1007/978-981-15-7090-2_14 -
8
المؤلفون: null Songhua Shi, null Daoqiang Lu, C.P. Wong
المصدر: IEEE Transactions on Electronics Packaging Manufacturing. 22:268-273
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9
المؤلفون: null Songhua Shi, T. Yamashita, C.P. Wong
المصدر: IEEE Transactions on Electronics Packaging Manufacturing. 22:274-281
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10
المؤلفون: Bernhard Wunderlich, Ze Zhang, Songhua Shi, Hanjie Hu, Haishan Bu, Erqiang Chen
المصدر: Journal of Macromolecular Science, Part B. 35:731-747
مصطلحات موضوعية: Materials science, Polymers and Plastics, Ethylene oxide, Annealing (metallurgy), technology, industry, and agriculture, Oxide, General Chemistry, Condensed Matter Physics, law.invention, chemistry.chemical_compound, chemistry, law, Polymer chemistry, Materials Chemistry, Physical chemistry, Molar mass distribution, Molecule, Electron microscope, Crystal twinning, Single crystal