يعرض 1 - 10 نتائج من 3,904 نتيجة بحث عن '"Trinchero A"', وقت الاستعلام: 1.05s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :639-642 May, 2024

    Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

  2. 2
    مؤتمر

    المصدر: 2024 4th URSI Atlantic Radio Science Meeting (AT-RASC) URSI Atlantic Radio Science Meeting (AT-RASC), 2024 4th. :1-4 May, 2024

    Relation: 2024 4th URSI Atlantic Radio Science Meeting (AT-RASC)

  3. 3
    مؤتمر

    المصدر: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2024 IEEE 28th Workshop on. :1-4 May, 2024

    Relation: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI)

  4. 4
    تقرير

    المؤلفون: Aprile, E., Aalbers, J., Abe, K., Maouloud, S. Ahmed, Althueser, L., Andrieu, B., Angelino, E., Martin, D. Antón, Arneodo, F., Baudis, L., Bazyk, M., Bellagamba, L., Biondi, R., Bismark, A., Boese, K., Brown, A., Bruno, G., Budnik, R., Cai, C., Capelli, C., Cardoso, J. M. R., Chávez, A. P. Cimental, Colijn, A. P., Conrad, J., Cuenca-García, J. J., D'Andrea, V., Garcia, L. C. Daniel, Decowski, M. P., Deisting, A., Di Donato, C., Di Gangi, P., Diglio, S., Eitel, K., Elykov, A., Ferella, A. D., Ferrari, C., Fischer, H., Flehmke, T., Flierman, M., Fulgione, W., Fuselli, C., Gaemers, P., Gaior, R., Galloway, M., Gao, F., Ghosh, S., Giacomobono, R., Glade-Beucke, R., Grandi, L., Grigat, J., Guan, H., Guida, M., Gyorgy, P., Hammann, R., Higuera, A., Hils, C., Hoetzsch, L., Hood, N. F., Iacovacci, M., Itow, Y., Jakob, J., Joerg, F., Kaminaga, Y., Kara, M., Kavrigin, P., Kazama, S., Kobayashi, M., Koke, D., Kopec, A., Kuger, F., Landsman, H., Lang, R. F., Levinson, L., Li, I., Li, S., Liang, S., Lin, Y. -T., Lindemann, S., Lindner, M., Liu, K., Liu, M., Loizeau, J., Lombardi, F., Long, J., Lopes, J. A. M., Luce, T., Ma, Y., Macolino, C., Mahlstedt, J., Mancuso, A., Manenti, L., Marignetti, F., Undagoitia, T. Marrodán, Martens, K., Masbou, J., Masson, E., Mastroianni, S., Melchiorre, A., Merz, J., Messina, M., Michael, A., Miuchi, K., Molinario, A., Moriyama, S., Morå, K., Mosbacher, Y., Murra, M., Müller, J., Ni, K., Oberlack, U., Paetsch, B., Pan, Y., Pellegrini, Q., Peres, R., Peters, C., Pienaar, J., Pierre, M., Plante, G., Pollmann, T. R., Principe, L., Qi, J., Qin, J., García, D. Ramírez, Rajado, M., Singh, R., Sanchez, L., Santos, J. M. F. dos, Sarnoff, I., Sartorelli, G., Schreiner, J., Schulte, P., Eißing, H. Schulze, Schumann, M., Lavina, L. Scotto, Selvi, M., Semeria, F., Shagin, P., Shi, S., Shi, J., Silva, M., Simgen, H., Takeda, A., Tan, P. -L., Thers, D., Toschi, F., Trinchero, G., Tunnell, C. D., Tönnies, F., Valerius, K., Vecchi, S., Vetter, S., Solar, F. I. Villazon, Volta, G., Weinheimer, C., Weiss, M., Wenz, D., Wittweg, C., Wu, V. H. S., Xing, Y., Xu, D., Xu, Z., Yamashita, M., Yang, L., Ye, J., Yuan, L., Zavattini, G., Zhong, M.

  5. 5
    دورية أكاديمية

    المصدر: IEEE Transactions on Power Delivery IEEE Trans. Power Delivery Power Delivery, IEEE Transactions on. 39(3):1827-1839 Jun, 2024

  6. 6
    دورية أكاديمية

    المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 66(2):513-524 Apr, 2024

  7. 7
    تقرير

    المؤلفون: XENON Collaboration, Aprile, E., Aalbers, J., Abe, K., Maouloud, S. Ahmed, Althueser, L., Andrieu, B., Angelino, E., Martin, D. Antón, Arneodo, F., Baudis, L., Bazyk, M., Bellagamba, L., Biondi, R., Bismark, A., Boese, K., Brown, A., Bruno, G., Budnik, R., Cardoso, J. M. R., Chávez, A. P. Cimental, Colijn, A. P., Conrad, J., Cuenca-García, J. J., D'Andrea, V., Garcia, L. C. Daniel, Decowski, M. P., Di Donato, C., Di Gangi, P., Diglio, S., Eitel, K., Elykov, A., Ferella, A. D., Ferrari, C., Fischer, H., Flehmke, T., Flierman, M., Fulgione, W., Fuselli, C., Gaemers, P., Gaior, R., Galloway, M., Gao, F., Ghosh, S., Giacomobono, R., Glade-Beucke, R., Grandi, L., Grigat, J., Guan, H., Guida, M., Gyoergy, P., Hammann, R., Higuera, A., Hils, C., Hoetzsch, L., Hood, N. F., Iacovacci, M., Itow, Y., Jakob, J., Joerg, F., Kaminaga, Y., Kara, M., Kavrigin, P., Kazama, S., Kobayashi, M., Kopec, A., Kuger, F., Landsman, H., Lang, R. F., Levinson, L., Li, I., Li, S., Liang, S., Lin, Y. -T., Lindemann, S., Lindner, M., Liu, K., Loizeau, J., Lombardi, F., Long, J., Lopes, J. A. M., Luce, T., Ma, Y., Macolino, C., Mahlstedt, J., Mancuso, A., Manenti, L., Marignetti, F., Undagoitia, T. Marrodán, Martens, K., Masbou, J., Masson, E., Mastroianni, S., Melchiorre, A., Messina, M., Michael, A., Miuchi, K., Molinario, A., Moriyama, S., Morå, K., Mosbacher, Y., Murra, M., Müller, J., Ni, K., Oberlack, U., Paetsch, B., Pan, Y., Pellegrini, Q., Peres, R., Peters, C., Pienaar, J., Pierre, M., Plante, G., Pollmann, T. R., Principe, L., Qi, J., Qin, J., García, D. Ramírez, Rajado, M., Singh, R., Sanchez, L., Santos, J. M. F. dos, Sarnoff, I., Sartorelli, G., Schreiner, J., Schulte, D., Schulte, P., Eißing, H. Schulze, Schumann, M., Lavina, L. Scotto, Selvi, M., Semeria, F., Shagin, P., Shi, S., Shi, J., Silva, M., Simgen, H., Takeda, A., Tan, P. -L., Terliuk, A., Thers, D., Toschi, F., Trinchero, G., Tunnell, C. D., Tönnies, F., Valerius, K., Vecchi, S., Vetter, S., Solar, F. I. Villazon, Volta, G., Weinheimer, C., Weiss, M., Wenz, D., Wittweg, C., Wu, V. H. S., Xing, Y., Xu, D., Xu, Z., Yamashita, M., Yang, L., Ye, J., Yuan, L., Zavattini, G., Zhong, M.

  8. 8
    دورية أكاديمية

    المصدر: IEEE Open Journal of the Communications Society IEEE Open J. Commun. Soc. Communications Society, IEEE Open Journal of the. 5:1072-1087 2024

  9. 9
    مؤتمر

    المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023

    Relation: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

  10. 10
    مؤتمر

    المصدر: 2023 IEEE Conference on AgriFood Electronics (CAFE) AgriFood Electronics (CAFE), 2023 IEEE Conference on. :128-131 Sep, 2023

    Relation: 2023 IEEE Conference on AgriFood Electronics (CAFE)