-
1مؤتمر
المؤلفون: Arimura, H., Franco, J., Ragnarsson, L.-A., Vandooren, A., Brus, S., Maqsood, W., Conard, T., Verni, G. Alessio, Maes, J. W., Kannan, B., Givens, M., Horiguchi, N.
المصدر: 2024 IEEE Silicon Nanoelectronics Workshop (SNW) Silicon Nanoelectronics Workshop (SNW), 2024 IEEE. :47-48 Jun, 2024
Relation: 2024 IEEE Silicon Nanoelectronics Workshop (SNW)
-
2مؤتمر
المؤلفون: Arimura, H., Brus, S., Franco, J., Oniki, Y., Vandooren, A., Conard, T., Chan, B.-T., Kannan, B., Samiee, M., Li, W., Deminskyi, P., Shero, E., Bakke, J., Jourdan, N., Verni, G. Alessio, Maes, J. W., Givens, M., Ragnarsson, L.-A., Mitard, J., Litta, E. Dentoni, Horiguchi, N.
المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023
Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
-
3مؤتمر
المؤلفون: Arimura, H., Ragnarsson, L.-A., Oniki, Y., Franco, J., Vandooren, A., Brus, S., Leonhardt, A., Sippola, P., Ivanova, T., Verni, G. Alessio, Chang, R.-J., Xie, Q., Givens, M., Mitard, J., Biesemans, S., Litta, E. Dentoni, Horiguchi, N.
المصدر: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :13.5.1-13.5.4 Dec, 2021
Relation: 2021 IEEE International Electron Devices Meeting (IEDM)
-
4كتاب إلكتروني
المؤلفون: Giberti, H.Aff00041, Resta, F.Aff00041, Sabbioni, E.Aff00041, Vergani, L.Aff00041, Colombo, C.Aff00041, Verni, G.Aff00042, Boccafogli, E.Aff00042
المساهمون: Allemang, Randall, editorAff43, De Clerck, James, editorAff44, Niezrecki, Christopher, editorAff45, Wicks, Alfred, editorAff46
المصدر: Special Topics in Structural Dynamics, Volume 6 : Proceedings of the 31st IMAC, A Conference on Structural Dynamics, 2013. :35-45
-
5دورية أكاديمية
المؤلفون: Parel, I., Cutti, A.G., Fiumana, G., Porcellini, G., Verni, G., Accardo, A.P.
المصدر: In Gait & Posture April 2012 35(4):636-640
-
6دورية أكاديمية
المؤلفون: Colombo, C., Marchesin, E.G., L.Vergani, Boccafogli, E., Verni, G.
المصدر: In Procedia Engineering 2011 10:3510-3517
-
7دورية أكاديمية
المؤلفون: Colombo, C., Marchesin, E.G., Vergani, L., Boccafogli, E., Verni, G.
المصدر: In Procedia Engineering 2011 10:3503-3509
-
8دورية أكاديمية
المؤلفون: Parel, I., Cutti, A. G., Kraszewski, A., Verni, G., Hillstrom, H., Kontaxis, A.
المصدر: Medical & Biological Engineering & Computing. March 2014 52(3):271-282
-
9
المؤلفون: Andreoni G., Costa F., Dall’Amico M., Frigo C., Gruppioni E., Muschiato S., Pavan E., Piccoli M., Romero M., Saldutto B.G., Standoli C.E., Verni G., Vignati G.
المصدر: Advances in Human Aspects of Healthcare.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9afd2d6a7e1e50f6dcf7131c3affb31d
https://doi.org/10.54941/ahfe100503 -
10
المؤلفون: Chiara Colombo, Marchesin, E. G., Vergani, L., Boccafogli, E., Verni, G.
المصدر: Scopus-Elsevier
مصطلحات موضوعية: Building and Construction, Civil and Structural Engineering