المؤلفون: Zhang, Qinqiang, Suzuki, Ken, Miura, Hideo

المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :171-174 Sep, 2021

Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: 张沁强，陈竞男，姚双燕，窦伟国，彭丹，毕艳兰 ZHANG Qinqiang, CHEN Jingnan, YAO Shuangyan, DOU Weiguo, PENG Dan, BI Yanlan

المصدر: Zhongguo youzhi, Vol 49, Iss 2, Pp 108-113 (2024)

مصطلحات موضوعية: 大豆油脱臭馏分；重相组分；甾醇酯；柱层析, soybean oil deodorizer distillate, waste residue, sterol esters, column chromatography, Oils, fats, and waxes, TP670-699

وصف الملف: electronic resource

Relation: http://tg.chinaoils.cn/zgyz/ch/reader/create_pdf.aspx?file_no=20240219&flag=1; https://doaj.org/toc/1003-7969

URL الوصول: https://doaj.org/article/0f444165a7294eccbf0ad3b0eef88718

المؤلفون: Zhang, Qinqiang, Suzuki, Ken, Miura, Hideo

المصدر: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :379-382 Sep, 2020

Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Zhang, Qinqiang, Kudo, Takuya, Gounder, Jowesh, Chen, Ying, Suzuki, Ken, Miura, Hideo

المصدر: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2019 International Conference on. :1-4 Sep, 2019

Relation: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Zhang, Qinqiang, Suzuki, Ken, Miura, Hideo

المصدر: 2018 20th International Conference on Electronic Materials and Packaging (EMAP) Electronic Materials and Packaging (EMAP), 2018 20th International Conference on. :1-5 Dec, 2018

Relation: 2018 20th International Conference on Electronic Materials and Packaging (EMAP)

المؤلفون: Zhang, Qinqiang, Kudo, Takuya, Suzuki, Ken, Miura, Hideo

المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :161-164 Oct, 2018

Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Goundar, Jowesh Avisheik, Zhang, Qinqiang, Suzuki, Ken, Miura, Hideo

المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :147-148 May, 2021

Relation: 2021 International Conference on Electronics Packaging (ICEP)

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: ZHANG Qinqiang, CHEN Jingnan, YAO Shuangyan, DOU Weiguo, PENG Dan, BI Yanlan

المصدر: China Oils & Fats; 2024, Vol. 49 Issue 2, p108-113, 6p

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.