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1مؤتمر
المؤلفون: Blanchini, Franco, Casagrande, Daniele
المصدر: 2023 European Control Conference (ECC) Control Conference (ECC), 2023 European. :1-5 Jun, 2023
Relation: 2023 European Control Conference (ECC)
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2دورية أكاديمية
المؤلفون: Li, Haitao, Zheng, Tianyu, Qin, Weiyang, Tian, Ruilan, Ding, HuAff4, IDs1048302430985_cor5, Ji, J. C., Chen, Liqun
المصدر: Applied Mathematics and Mechanics: English Edition. 45(3):461-478
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3كتاب إلكتروني
المؤلفون: Khasawneh, Mohammad A.Aff3, Aff4, Daqaq, Mohammed F.Aff3, Aff4
المساهمون: Lacarbonara, Walter, Series EditorAff1, Aff2
المصدر: Advances in Nonlinear Dynamics, Volume III : Proceedings of the Third International Nonlinear Dynamics Conference (NODYCON 2023). :217-226
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4دورية أكاديمية
المؤلفون: Saleh Khir, Redha Rebhi, Mohamed Kezrane, Mohamed Naceur Borjini
المصدر: East European Journal of Physics, Iss 1, Pp 203-220 (2024)
مصطلحات موضوعية: bi-stability, thermosolutal convection, power-law fluid, porous layer, non-newtonian binary fluid, Physics, QC1-999
وصف الملف: electronic resource
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5مؤتمر
المؤلفون: Masabi, Sayed Nahiyan, Fu, Hailing, Theodossiades, Stephanos
المصدر: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) SSolid-State Sensors, Actuators and Microsystems (Transducers), 2021 21st International Conference on. :956-959 Jun, 2021
Relation: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
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6مؤتمر
المؤلفون: Dubois, Raphaël, Andrianne, Thomas, Di Silvestro, Elena
المساهمون: Wind Tunnel Laboratory (University of Liège)
المصدر: 17th Conference on Wind Engineering - IN-VENTO 2022, Milan, Italy [IT], 4-7 September 2022
مصطلحات موضوعية: Two cylinders, Bi-stability, Gap flow, Engineering, computing & technology, Civil engineering, Mechanical engineering, Ingénierie, informatique & technologie, Ingénierie civile, Ingénierie mécanique
URL الوصول: https://orbi.uliege.be/handle/2268/306594
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7دورية أكاديمية
المؤلفون: Wu, HaipingAff1, Aff2, Aff3, Fang, HongbinAff1, Aff2, Aff3, IDs10338023003912_cor2
المصدر: Acta Mechanica Solida Sinica: The Chinese Society of Theoretical and Applied Mechanics. 36(4):554-568
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8مؤتمر
المصدر: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :237-240 Sep, 2020
Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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9دورية أكاديمية
المؤلفون: Shivanna, Naveen Koppa, Clement, ShibuAff1, IDs12046023023168_cor2, Ranjan, Pritanshu
المصدر: Sādhanā: Published by the Indian Academy of Sciences. 48(4)
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10دورية أكاديمية
المؤلفون: Beem, Jennifer, Hannah, Iain, Hosoi, A.E.
المصدر: International Journal of Clothing Science and Technology, 2023, Vol. 35, Issue 5, pp. 685-697.