يعرض 1 - 10 نتائج من 1,085 نتيجة بحث عن '"shear load"', وقت الاستعلام: 0.84s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Uncovering Failure and Cracking Behaviors of Double-Flawed Sandstone Under Compressive-Shear Loading Using Digital Image Correlation (DIC) Technique

    المؤلفون: Zhou, TaoAff1, Aff2, Chen, JiarongAff1, Aff2, Aff3, IDs00603024038452_cor2, Wang, FeiAff2, Aff4, Zhou, ChangtaiAff5, IDs00603024038452_cor4

    المصدر: Rock Mechanics and Rock Engineering. 57(8):6183-6209

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  2. 2
    دورية أكاديمية
    Numerical Study on the Shear Resistance Behavior of Steel Plate Shear Walls with Full Height Opening and Different Configurations of Stiffeners

    المؤلفون: Davoudi-Kia, AbdullahAff1, IDs40996024015315_cor1, Hasanzadeh, Ali, Rezapour Mazandarani, Reza

    المصدر: Iranian Journal of Science and Technology, Transactions of Civil Engineering. :1-12

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  3. 3
    مؤتمر
    Process Recipes of Additively Printed Sustainable Silver-Ink Using Aerosol Jet Printing

    المؤلفون: Lall, Pradeep, Bimali, Sabina, Soni, Ved, Miller, Scott

    المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023

    Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  4. 4
    مؤتمر
    Process Recipes and Performance of Printable Formable inks for In-Mold Electronics Applications

    المؤلفون: Lall, Pradeep, Naranagaparambil, Jinesh, Miller, Scott

    المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023

    Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  5. 5
    دورية أكاديمية
    Induced Stress Fields in Isotropic Elastic Discs Due to Contact Shear Stresses and Their Implications for Brazilian Test Strength Characterization

    المؤلفون: Guerrero-Miguel, Diego-JoséAff1, IDs1065902410072x_cor1, Prendes-Gero, María-Belén, Álvarez-Fernández, Martina-Inmaculada, González-Nicieza, Celestino

    المصدر: Journal of Elasticity: The Physical and Mathematical Science of Solids. 156(3):721-737

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  6. 6
    مؤتمر
    Influence of Component Interconnect with Printed Copper Circuits on Realized Mechanical and Electrical Characteristics in FHE Applications

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-10 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  7. 7
    مؤتمر
    Process Development for Fabrication of Copper Additive-Multilayer Circuits with Component Attachment using ECA and LTS

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Schulze, Kyle, Hill, Curtis

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-9 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  8. 8
    مؤتمر
    Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-12 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  9. 9
    مؤتمر
    Interaction of Photonic Curing Process Parameters on Additively Printed Copper Circuits

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Hill, Curtis

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-10 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  10. 10
    مؤتمر
    Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1172-1183 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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